NXP Semiconductors - BAP50-03T/R

BAP50-03T/R by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BAP50-03T/R
Description PIN DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Datasheet BAP50-03T/R Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Config: SINGLE
Diode Type: PIN DIODE
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Diode Element Material: SILICON
No. of Terminals: 2
Qualification: Not Qualified
Terminal Position: DUAL
Maximum Diode Capacitance: .55 pF
Package Style (Meter): SMALL OUTLINE
Technology: POSITIVE-INTRINSIC-NEGATIVE
JESD-30 Code: R-PDSO-G2
No. of Elements: 1
Package Shape: RECTANGULAR
Maximum Power Dissipation: .5 W
Terminal Form: GULL WING
Maximum Operating Temperature: 150 Cel
Maximum Diode Forward Resistance: 5 ohm
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