Nexperia - 74AXP1G57GXZ

74AXP1G57GXZ by Nexperia

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Manufacturer Nexperia
Manufacturer's Part Number 74AXP1G57GXZ
Description MAJORITY LOGIC GATE; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR;
Datasheet 74AXP1G57GXZ Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: .35 mm
No. of Inputs: 3
Minimum Supply Voltage (Vsup): .7 V
Surface Mount: YES
Terminal Finish: NICKEL PALLADIUM GOLD
No. of Terminals: 6
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBCC-B6
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Package Code: HVBCC
Width: .8 mm
Moisture Sensitivity Level (MSL): 1
Logic IC Type: MAJORITY LOGIC GATE
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Length: 1 mm
Propagation Delay (tpd): 125 ns
Nominal Supply Voltage / Vsup (V): 1.2
Family: AXP
Peak Reflow Temperature (C): 260
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 2.75 V
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