National Semiconductor - LM5106SDX/NOPB

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

LTC7004MPMSE#TRPBF by Analog Devices is a MOSFET gate driver with a max supply voltage of 60V and turn-on/off time of 0.07us. It features a small outline package style suitable for high side driver applications. The device operates on CMOS technology, making it ideal for buffer or inverter based MOSFET driver interfaces.

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

UCC21521ADW by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 6A. It operates in automotive-grade temperatures from -40 to 125°C and has a turn-on/off time of 0.03us. This driver is suitable for applications requiring high side drivers in compact spaces due to its small outline package style.

UCC27322DRG4 by Texas Instruments is a MOSFET gate driver with a supply voltage range of 4.5V to 15V, output current up to 9A, and turn-on/off time of 0.07us. It is ideal for industrial applications requiring high-speed switching such as power supplies and motor control systems.

HALF BRIDGE BASED MOSFET DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

LT1910IS8#PBF by Analog Devices is a MOSFET Gate Driver with 8 terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 12-48 V and features high side driver functionality. Ideal for automotive applications due to its small outline package style and dual terminal position.

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;

BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

HALF BRIDGE BASED IGBT/MOSFET DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: TSOP; Package Shape: RECTANGULAR;

BUFFER OR INVERTER BASED MOSFET DRIVER; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;

BUFFER OR INVERTER BASED MOSFET DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

UCC27524DGNR by Texas Instruments is a MOSFET gate driver with 2 functions, operating at supply voltages of 4.5-18V. With a max output current of 5A and turn-on/off time of 0.023us, it's ideal for automotive applications requiring high-speed switching control in compact spaces.

BUFFER OR INVERTER BASED MOSFET DRIVER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;

PDRV8353SRTA by Texas Instruments is a MOSFET gate driver with a max supply voltage of 95V and operating temperature range from -40 to 125°C. It features a half-bridge based interface IC type, suitable for automotive applications due to its low profile chip carrier package style and high side driver capability.