Microsemi - VSC8501XML-03

VSC8501XML-03 by Microsemi

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Manufacturer Microsemi
Manufacturer's Part Number VSC8501XML-03
Description TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 135; Package Code: QCCN; Package Shape: SQUARE;
Datasheet VSC8501XML-03 Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Telecom IC Type: TELECOM CIRCUIT
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 135
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
JESD-30 Code: S-XQCC-N135
Package Shape: SQUARE
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: QCCN
Temperature Grade: AUTOMOTIVE
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