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Manufacturer | Microsemi |
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Manufacturer's Part Number | M2S090-FCS325 |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Pitch Of Terminal: .5 mm; |
Datasheet | M2S090-FCS325 Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.14 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.16 mm |
No. of Inputs: | 180 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | YES |
No. of Outputs: | 180 |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 325 |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B325 |
Package Shape: | RECTANGULAR |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 11 mm |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
Technology Used: | CMOS |
No. of Logic Cells: | 86316 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA325,21X21,20 |
Finishing Of Terminal Used: | Tin/Lead (Sn/Pb) |
Length: | 13.5 mm |
Form Of Terminal: | BALL |
Additional Features: | LG-MIN, WD-MIN |
Pitch Of Terminal: | .5 mm |
Peak Reflow Temperature (C): | 240 |
Power Supplies (V): | 1.2 |