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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | MT53E256M32D2DS-053AIT:B |
| Description | LPDDR4 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 256MX32; |
| Datasheet | MT53E256M32D2DS-053AIT:B Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256MX32 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .8 mm |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.06 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 200 |
| Maximum Clock Frequency (fCLK): | 1866 MHz |
| No. of Words: | 268435456 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B200 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 95 Cel |
| Package Code: | VFBGA |
| Width: | 10 mm |
| Input/Output Type: | COMMON |
| No. of Ports: | 1 |
| Memory Density: | 8589934592 bit |
| Self Refresh: | YES |
| Sequential Burst Length: | 16,32 |
| Memory IC Type: | LPDDR4 DRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 32 |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA200,12X22,32/25 |
| Interleaved Burst Length: | 16,32 |
| Length: | 14.5 mm |
| No. of Words Code: | 256M |
| Nominal Supply Voltage / Vsup (V): | 1.1 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.17 V |
