Microchip Technology - MGC3030-I/SS

MGC3030-I/SS by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number MGC3030-I/SS
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
Datasheet MGC3030-I/SS Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 40
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: 2 mm
Surface Mount: YES
Terminal Finish: MATTE TIN
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 28
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, SHRINK PITCH
Length: 10.2 mm
JESD-30 Code: R-PDSO-G28
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: SSOP
Width: 5.3 mm
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 2
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