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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | MCP2518FDT-E/QBBVAO |
| Description | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR; |
| Datasheet | MCP2518FDT-E/QBBVAO Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 2.7 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .9 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 20 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 14 |
| No. of Serial I/Os: | 1 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Address Bus Width: | 0 |
| Screening Level: | AEC-Q100; TS 16949 |
| Maximum Data Transfer Rate: | 1 MBps |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-N14 |
| Maximum Clock Frequency: | 40 MHz |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | HVSON |
| Width: | 3 mm |
| Peripheral IC Type: | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Maximum Supply Voltage: | 5.5 V |
| Low Power Mode: | YES |
| Boundary Scan: | NO |
| External Data Bus Width: | 0 |
| Communication Protocol: | SYNC; BIT ;BYTE |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | LCC14,.18X.12,30 |
| Length: | 4.5 mm |
| Peak Reflow Temperature (C): | 260 |
| Bus Compatibility: | SPI |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | AUTOMOTIVE |
