Microchip Technology - MCP2518FDT-E/QBB

MCP2518FDT-E/QBB by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number MCP2518FDT-E/QBB
Description SERIAL IO/COMMUNICATION CONTROLLER, CAN; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: RECTANGULAR;
Datasheet MCP2518FDT-E/QBB Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: .9 mm
Surface Mount: YES
Maximum Supply Current: 20 mA
Terminal Finish: MATTE TIN
No. of Terminals: 14
No. of Serial I/Os: 1
Terminal Position: DUAL
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level: TS 16949
Maximum Data Transfer Rate: 1 MBps
Technology: CMOS
JESD-30 Code: R-PDSO-N14
Maximum Clock Frequency: 40 MHz
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 125 Cel
Package Code: HVQCCN
Width: 3 mm
Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, CAN
Maximum Supply Voltage: 5.5 V
Low Power Mode: YES
Boundary Scan: NO
Communication Protocol: SYNC; BIT ;BYTE
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: SOLCC14,.12,25
Length: 4.5 mm
Peak Reflow Temperature (C): 260
Bus Compatibility: SPI
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
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