![M2S090-FCS325 by Microchip Technology M2S090-FCS325 by Microchip Technology](https://partstack.com/images/categories/grey/200/1x/field_programmable_gate_arrays.webp)
Image shown is a representation only.
Manufacturer | Microchip Technology |
---|---|
Manufacturer's Part Number | M2S090-FCS325 |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Position Of Terminal: BOTTOM; |
Datasheet | M2S090-FCS325 Datasheet |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.14 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.16 mm |
No. of Inputs: | 180 |
Surface Mount: | YES |
No. of Outputs: | 180 |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 325 |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B325 |
Package Shape: | RECTANGULAR |
Maximum Operating Temperature: | 85 Cel |
Package Code: | TFBGA |
Width: | 11 mm |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
No. of Logic Cells: | 86184 |
Minimum Operating Temperature: | 0 Cel |
Package Equivalence Code: | BGA325,21X21,20 |
Finishing Of Terminal Used: | TIN LEAD |
Length: | 13.5 mm |
Form Of Terminal: | BALL |
Pitch Of Terminal: | .5 mm |
Peak Reflow Temperature (C): | 240 |