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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | DSPIC33FJ64GS610-I/PT |
| Description | DIGITAL SIGNAL PROCESSOR, CONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TQFP; Package Shape: SQUARE; |
| Datasheet | DSPIC33FJ64GS610-I/PT Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Integrated Cache: | NO |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| On Chip Data RAM Width: | 8 |
| No. of DMA Channels: | 4 |
| Address Bus Width: | 0 |
| Screening Level: | TS 16949 |
| Technology: | CMOS |
| RAM Words: | 9216 |
| Maximum Clock Frequency: | 40 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Package Code: | TQFP |
| Moisture Sensitivity Level (MSL): | 3 |
| No. of External Interrupts: | 5 |
| Bit Size: | 16 |
| DAC Channels: | YES |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TQFP100,.55SQ,16 |
| PWM Channels: | YES |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Terminal Pitch: | .4 mm |
| CPU Family: | PIC |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Seated Height: | 1.2 mm |
| Maximum Supply Current: | 170 mA |
| Terminal Finish: | MATTE TIN |
| ADC Channels: | YES |
| No. of Terminals: | 100 |
| No. of Timers: | 7 |
| No. of Serial I/Os: | 2 |
| DMA Channels: | YES |
| Terminal Position: | QUAD |
| Format: | FIXED POINT |
| Package Style (Meter): | FLATPACK, THIN PROFILE |
| No. of I/O Lines: | 85 |
| JESD-30 Code: | S-PQFP-G100 |
| ROM Words: | 65536 |
| Maximum Operating Temperature: | 85 Cel |
| Width: | 12 mm |
| Speed: | 40 rpm |
| Peripheral IC Type: | DIGITAL SIGNAL PROCESSOR, CONTROLLER |
| Maximum Supply Voltage: | 3.6 V |
| RAM Bytes: | 9216 |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 0 |
| Barrel Shifter: | YES |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Internal Bus Architecture: | MULTIPLE |
| Length: | 12 mm |
| On Chip Program ROM Width: | 24 |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |
