Microchip Technology - ATSAMA5D27C-LD1G-CU

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ATSAMA5D27C-LD1G-CU by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number ATSAMA5D27C-LD1G-CU
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 361; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet ATSAMA5D27C-LD1G-CU Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: YES
Maximum Seated Height: 1.2 mm
Surface Mount: YES
On Chip Data RAM Width: 32
No. of Terminals: 361
No. of Serial I/Os: 1
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
No. of DMA Channels: 51
Address Bus Width: 0
Technology: CMOS
RAM Words: 32768
JESD-30 Code: S-PBGA-G361
Maximum Clock Frequency: 24 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 16 mm
Speed: 500 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.9 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 0
Bit Size: 16
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA361,19X19,32
Length: 16 mm
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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