Microchip Technology - AT91SAM9261B-CU-999

MICROPROCESSOR, RISC;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROCONTROLLER, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;

AM5706BCBDJA by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. It is suitable for industrial applications requiring low power mode, operating at a max clock frequency of 38.4 MHz. The package style is grid array with 538 terminals in a square shape measuring 17mm x 17mm.

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;

KMPC8270CVRMIBA by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 266 MHz and is suitable for applications requiring high-speed processing, such as networking equipment and industrial automation systems.

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;

Analog Devices' ADSP-21489KSWZ-3A microprocessor features 40-bit size, 24-bit address bus width, and 163840 RAM words. Ideal for applications requiring a max clock frequency of 25 MHz, such as embedded systems and signal processing tasks. With a terminal pitch of 0.5 mm and GULL WING form factor, it offers efficient performance in compact designs.

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1089; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Integrated Cache: YES;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Length: 21.02 mm;

Microprocessors;