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Manufacturer | Microchip Technology |
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Manufacturer's Part Number | A3P1000-FG144I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE; |
Datasheet | A3P1000-FG144I Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.425 V |
Package Body Material: | PLASTIC/EPOXY |
Organization: | 24576 CLBS, 1000000 GATES |
Maximum Time At Peak Reflow Temperature (s): | 20 |
Maximum Seated Height: | 1.55 mm |
Surface Mount: | YES |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 144 |
No. of Equivalent Gates: | 1000000 |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
JESD-30 Code: | S-PBGA-B144 |
Maximum Clock Frequency: | 350 MHz |
Package Shape: | SQUARE |
Maximum Operating Temperature: | 100 Cel |
Package Code: | LBGA |
Width: | 13 mm |
Moisture Sensitivity Level (MSL): | 3 |
Grading Of Temperature: | INDUSTRIAL |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | 1.575 V |
Nominal Supply Voltage (V): | 1.5 |
Packing Method: | TRAY |
Technology Used: | CMOS |
No. of CLBs: | 24576 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Finishing Of Terminal Used: | TIN LEAD |
Length: | 13 mm |
Form Of Terminal: | BALL |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 235 |