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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | MAX9879ERV+TCEP |
| Description | VOLUME CONTROL CIRCUIT; Terminal Form: BALL; No. of Terminals: 30; Package Code: VFBGA; Package Shape: RECTANGULAR; Technology: BICMOS; |
| Datasheet | MAX9879ERV+TCEP Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .69 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 24 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 30 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | BICMOS |
| JESD-30 Code: | R-PBGA-B30 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| No. of Channels: | 3 |
| Package Code: | VFBGA |
| General IC Type: | VOLUME CONTROL CIRCUIT |
| Width: | 2.54 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Channel Separation: | 75 dB |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA30,5X6,20 |
| Length: | 3.05 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Maximum Supply Voltage (Vsup): | 3.6 V |
