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| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | DS2502X1+ |
| Description | OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Code: VBGA; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; |
| Datasheet | DS2502X1+ Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 128X8 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .639 mm |
| Minimum Supply Voltage (Vsup): | 2.8 V |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER NICKEL |
| No. of Terminals: | 2 |
| No. of Words: | 128 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B2 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VBGA |
| Width: | .91 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Input/Output Type: | COMMON |
| Memory Density: | 1024 bit |
| Memory IC Type: | OTP ROM |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA4,2X2,37/16 |
| Length: | 1.6 mm |
| Maximum Access Time: | 15000 ns |
| No. of Words Code: | 128 |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | .933 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 6 V |
| Power Supplies (V): | 3/5 |
