Image shown is a representation only.
| Manufacturer | Maxim Integrated |
|---|---|
| Manufacturer's Part Number | DS2155GB/T&R |
| Description | FRAMER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | DS2155GB/T&R Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Carrier Type-2: | T-1(DS1) |
| Carrier Type-1: | CEPT PCM-30/E-1 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| No. of Terminals: | 100 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| JESD-30 Code: | S-PBGA-B100 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | FBGA |
| Width: | 10 mm |
| Telecom IC Type: | FRAMER |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA100,10X10,32 |
| Length: | 10 mm |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 3.3 |
