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Manufacturer | Lattice Semiconductor |
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Manufacturer's Part Number | LFXP2-8E-5FTN256I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; |
Datasheet | LFXP2-8E-5FTN256I Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.14 V |
Package Body Material: | PLASTIC/EPOXY |
Maximum Combinatorial Delay of a CLB: | .494 ns |
Maximum Seated Height: | 2.1 mm |
No. of Inputs: | 201 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | YES |
No. of Outputs: | 201 |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 256 |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-B256 |
Maximum Clock Frequency: | 435 MHz |
Package Shape: | SQUARE |
Maximum Operating Temperature: | 100 Cel |
Package Code: | BGA |
Width: | 17 mm |
Moisture Sensitivity Level (MSL): | 3 |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
Technology Used: | CMOS |
No. of Logic Cells: | 8000 |
No. of CLBs: | 1000 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA256,16X16,40 |
Finishing Of Terminal Used: | TIN SILVER COPPER |
Length: | 17 mm |
Form Of Terminal: | BALL |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 260 |
Power Supplies (V): | 1.2,1.2/3.3,3.3 |