Intel - EP3C25F324I7

EP3C25F324I7 by Intel

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Manufacturer Intel
Manufacturer's Part Number EP3C25F324I7
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Datasheet EP3C25F324I7 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.15 V
Package Body Material: PLASTIC/EPOXY
Organization: 24624 CLBS
Maximum Seated Height: 1.9 mm
No. of Inputs: 215
Sub-Category: Field Programmable Gate Arrays
Surface Mount: YES
No. of Outputs: 215
Position Of Terminal: BOTTOM
No. of Terminals: 324
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 472.5 MHz
Package Shape: SQUARE
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: INDUSTRIAL
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: 1.25 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 24624
No. of CLBs: 24624
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA324,18X18,40
Finishing Of Terminal Used: TIN LEAD
Length: 19 mm
Form Of Terminal: BALL
Pitch Of Terminal: 1 mm
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