Integrated Device Technology - ISL32275EFVZ-T

ISL32275EFVZ-T by Integrated Device Technology

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Manufacturer Integrated Device Technology
Manufacturer's Part Number ISL32275EFVZ-T
Description TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet ISL32275EFVZ-T Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.2 mm
Surface Mount: YES
Terminal Finish: Matte Tin (Sn) - annealed
No. of Terminals: 16
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: BICMOS
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 125 Cel
Package Code: TSSOP
Width: 4.4 mm
Moisture Sensitivity Level (MSL): 2
Telecom IC Type: TELECOM CIRCUIT
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Length: 5 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: AUTOMOTIVE
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