Integrated Device Technology - 8P34S1106NLGI

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: SQUARE;

LMK03318RHST clock driver by Texas Instruments operates at 3.3V with 16 true outputs and a max frequency of 200MHz. Ideal for industrial applications, it features differential mux input conditioning and quad terminal position in a compact chip carrier package.

LOW SKEW CLOCK DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

AD9516-1BCPZ by Analog Devices features 1.18 ns propagation delay, 3.3V nominal voltage, and 10 true outputs at up to 800 MHz. Ideal for clock distribution in industrial applications due to its differential mux input conditioning and open-drain output characteristics.

ADCLK846BCPZ clock driver by Analog Devices features a propagation delay of 4.2ns, differential mux input conditioning, and 6 true outputs at a max frequency of 1200MHz. Ideal for industrial applications requiring precise timing control in compact spaces due to its small square chip carrier package style.

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

CDCLVD1208RHDT clock driver by Texas Instruments features a 2.5 ns propagation delay, operates at a supply voltage of 2.5V, and offers 8 true outputs. Ideal for industrial applications requiring differential mux input conditioning, this chip carrier package with a square shape is designed for surface mount assembly.

LOW SKEW CLOCK DRIVER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; No. of True Outputs: 6;

MC100LVEP11DTG clock driver by Onsemi features 0.31 ns propagation delay, 2.5V nominal voltage, and 50mA max power supply current. Ideal for industrial applications requiring differential input conditioning and fast signal propagation in a compact thin profile package.

ZL40234LDF1 by Microchip Technology is a clock driver & buffer with surface mount capability. It has a differential mux input conditioning and 1 function. With a square package, it operates at a nominal voltage of 2.5V and has a propagation delay of 2.07ns. Its compact size (5mm x 5mm) makes it suitable for various industrial applications requiring high frequency performance up to 1600MHz.

PLL BASED CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

CDCM61001RHBT clock driver by Texas Instruments operates at 3.3V with load capacitance of 5pF. It features a package style of CHIP CARRIER, suitable for industrial applications. With a max frequency of 683.28MHz, it is ideal for high-speed signal conditioning in electronic systems.

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 44; Package Code: HVQCCN; Package Shape: SQUARE;

PLL BASED CLOCK DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

LOW SKEW CLOCK DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

MC10E111FNG clock driver by Onsemi features 0.66ns propagation delay, 5V nominal voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring differential input conditioning in a square chip carrier package.