Infineon Technologies - PEF22827ELV1.1-G

PEF22827ELV1.1-G by Infineon Technologies

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	PEF22827ELV1.1-G
Description	MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE;
Datasheet	PEF22827ELV1.1-G Datasheet

PEF22827ELV1.1-G Technical Details

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Telecom IC Type:	MODEM
Sub-Category:	Modems
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	225
Qualification:	Not Qualified
Package Equivalence Code:	BGA225,15X15,32
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
JESD-30 Code:	S-PBGA-B225
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	1.8,3.3

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