Infineon Technologies - IRF7759L2TRPBF

IRF7759L2TRPBF by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number IRF7759L2TRPBF
Description N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 125 W; Maximum Drain-Source On Resistance: .0023 ohm; Transistor Element Material: SILICON;
Datasheet IRF7759L2TRPBF Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s): 30
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 26 A
Maximum Pulsed Drain Current (IDM): 640 A
Sub-Category: FET General Purpose Power
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 9
Maximum Power Dissipation (Abs): 125 W
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
JESD-30 Code: R-XBCC-N9
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 175 Cel
Case Connection: DRAIN
Maximum Drain-Source On Resistance: .0023 ohm
Moisture Sensitivity Level (MSL): 1
Avalanche Energy Rating (EAS): 257 mJ
Polarity or Channel Type: N-CHANNEL
JESD-609 Code: e1
Minimum DS Breakdown Voltage: 75 V
Qualification: Not Qualified
Maximum Drain Current (Abs) (ID): 113 A
Peak Reflow Temperature (C): 260
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