Infineon Technologies - CY7C4041KV13-667FCXC

CY7C4041KV13-667FCXC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY7C4041KV13-667FCXC
Description QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 361; Package Code: HBGA; Package Shape: SQUARE; Memory Density: 75497472 bit;
Datasheet CY7C4041KV13-667FCXC Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2MX36
Maximum Seated Height: 2.765 mm
Minimum Supply Voltage (Vsup): 1.26 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 361
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Technology: CMOS
JESD-30 Code: S-PBGA-B361
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: HBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 75497472 bit
Memory IC Type: QDR SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Length: 21 mm
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 1.3
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.34 V
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