Infineon Technologies - BSB104N08NP3GXUSA1

BSB104N08NP3GXUSA1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BSB104N08NP3GXUSA1
Description N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): NOT SPECIFIED; Case Connection: DRAIN; Package Shape: RECTANGULAR;
Datasheet BSB104N08NP3GXUSA1 Datasheet
NAME DESCRIPTION
Package Body Material: METAL
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 13 A
Maximum Pulsed Drain Current (IDM): 200 A
Surface Mount: YES
Terminal Finish: Silver/Nickel (Ag/Ni)
No. of Terminals: 3
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
JESD-30 Code: R-MBCC-N3
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ENHANCEMENT MODE
Case Connection: DRAIN
Maximum Drain-Source On Resistance: .0104 ohm
Moisture Sensitivity Level (MSL): 3
Avalanche Energy Rating (EAS): 110 mJ
Polarity or Channel Type: N-CHANNEL
JESD-609 Code: e4
Minimum DS Breakdown Voltage: 80 V
Peak Reflow Temperature (C): NOT SPECIFIED
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