Infineon Technologies - BSB017N03LX3G

BSB017N03LX3G by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BSB017N03LX3G
Description N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 57 W; Moisture Sensitivity Level (MSL): 3; Package Body Material: METAL;
Datasheet BSB017N03LX3G Datasheet
NAME DESCRIPTION
Package Body Material: METAL
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 147 A
Maximum Pulsed Drain Current (IDM): 400 A
Surface Mount: YES
No. of Terminals: 3
Maximum Power Dissipation (Abs): 57 W
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
JESD-30 Code: R-MBCC-N3
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 150 Cel
Case Connection: DRAIN
Maximum Drain-Source On Resistance: .0017 ohm
Moisture Sensitivity Level (MSL): 3
Avalanche Energy Rating (EAS): 225 mJ
Polarity or Channel Type: N-CHANNEL
Minimum Operating Temperature: -40 Cel
Minimum DS Breakdown Voltage: 30 V
Qualification: Not Qualified
Peak Reflow Temperature (C): 260
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