Infineon Technologies - BGS14MPA9E6327XTSA1

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVFLGA; Package Shape: RECTANGULAR; Maximum Supply Current: 500 mA;

ADL5561ACPZ-WP by Analog Devices is a 16-terminal cellphone IC with a square package shape and matte tin terminal finish. It operates b/w -40 to 85°C, suitable for industrial use in RF and baseband circuits at a nominal voltage of 3.3V. The chip carrier has a very thin profile, making it ideal for surface mount applications.

AD8348ARUZ-REEL7 by Analog Devices is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. The package is SMALL OUTLINE, THIN PROFILE, RECTANGULAR shape with PLASTIC/EPOXY material.

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: RECTANGULAR;

Telit ME310G1WW01T010100 is a 94-terminal RF & baseband circuit IC with 3.8V supply voltage, ideal for cellphone applications. With a compact size of 15x18mm and seated height of 2.6mm, it operates b/w -40°C to 85°C temperature range efficiently. The no-lead terminal form in MICROELECTRONIC ASSEMBLY package makes it suitable for modern mobile devices.

BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Shape: SQUARE; Width: 2.5 mm;

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: VQCCN; Package Shape: SQUARE; Surface Mount: YES;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Width: 14 mm;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;