Hittite Microwave - HMC850LC3

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR;

MAX6818EAP+T by Analog Devices is a BICMOS technology logic IC with 1 function. It operates at a supply voltage of 2.7-5.5V and has a temperature range of -40 to 125°C. This small outline, shrink pitch package is commonly used in automotive applications.

LOGIC CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

MAX6817EUT-T by Maxim Integrated is a BICMOS technology IC with 2 functions, operating at -40 to 125°C. It has a supply voltage range of 2.7-5.5V and comes in a small outline package for automotive applications. Features include 3-state output and dual terminals with tin-lead finish.

Other Logic ICs;

LOGIC CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 16; Package Code: LBGA; Package Shape: SQUARE;

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Other Logic ICs;

74AUP1G97GW,125 by NXP Semiconductors is a CMOS logic IC with a propagation delay of 22.2 ns and a load capacitance of 30 pF. It is commonly used in automotive applications due to its small size (1.25mm width) and high temperature tolerance (up to 125°C).

LOGIC CIRCUIT; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

Other Logic ICs;

74AUP1G97FHX by Onsemi is a CMOS logic IC with a propagation delay of 19ns at 1.2V, suitable for industrial applications. It operates b/w -40 to 85°C, has a load capacitance of 30pF, and can handle a max supply voltage of 3.6V. This Schmitt Trigger device comes in a small outline package with dual terminals for surface mount assembly.

LOGIC CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

Other Logic ICs; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;

LOGIC CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

Other Logic ICs; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE;

LOGIC CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

Other Logic ICs;

BUS DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 96; Package Code: FBGA; Package Shape: RECTANGULAR;