Fischer Elektronik & Kg - SK12950,8STS

HEAT SINK;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Width: 57.9 mm; Height: 11.4 mm; Length: 61 mm;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: TRANSVERSE; Finish: ANODIZED; Height: 19.05 mm;

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: FIN; Fin Orientation: LONGITUDINAL; Length: 44.45 mm;

Boyd's 577102B04000G Heat Sink has a thermal resistance of 25.9 ohm, U profile, and transverse fin orientation. Ideal for cooling electronic components in compact spaces due to its dimensions (13.21mm x 9.52mm x 19.05mm) and anodized black finish.

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Finish: ANODIZED; Height: 24.1 mm; Width: 57.9 mm;

Boyd 322400B00000G Heat Sink has Thermal Resistance of 99.99Ω, Height of 5.97mm, and Radial Fin Orientation. Ideal for cooling electronic components in compact devices like laptops and LED displays due to its efficient heat dissipation capabilities.

HEAT SINK;

Boyd's 552844B00000G Heat Sink has a Thermal Resistance of 8.7 ohm, Height of 18.29mm, and Width of 45.2mm. Ideal for cooling electronic components in various applications due to its anodized finish and aluminum construction.

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Construction: SLIDE ON; Fin Orientation: FOLDEDBACK; Height: 34.93 mm; Length: 21.84 mm;

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: LONGITUDINAL; Length: 59 mm; Height: 22.9 mm;

HEAT SINK; Body Material: ALUMINUM; Width: 13.2 mm; Length: 19.1 mm; Height: 9.5 mm; Color: BLACK;

HEAT SINK; Body Material: ALUMINUM ALLOY; Device Used On: SEMICONDUCTOR; Construction: EXTRUDED; Fin Orientation: FIN PIN; Width: 12.7 mm;

The Ohmite Manufacturing 274-1AB Heat Sink is 9.5mm in height, 13.2mm in width, and 19.1mm in length with an anodized black aluminum finish. Ideal for cooling electronic components in compact spaces like PCBs or LED lighting systems due to its small form factor and efficient heat dissipation capabilities.

HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Finish: TIN; Length: 22.86 mm; Thermal Resistance: 15 ohm;

HEAT SINK; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Height: 12.7 mm; Finish: ANODIZED; Length: 19.05 mm;

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 22.9 mm; Width: 57.5 mm;