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| Manufacturer | Cypress Semiconductor |
|---|---|
| Manufacturer's Part Number | CY7C1062G30-10BGXI |
| Description | STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: HBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; |
| Datasheet | CY7C1062G30-10BGXI Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 512KX32 |
| Maximum Seated Height: | 2.4 mm |
| Minimum Supply Voltage (Vsup): | 2.2 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 119 |
| No. of Words: | 524288 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B119 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HBGA |
| Width: | 14 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 16777216 bit |
| Memory IC Type: | STANDARD SRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 32 |
| No. of Functions: | 1 |
| Length: | 22 mm |
| Maximum Access Time: | 10 ns |
| No. of Words Code: | 512K |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
