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| Manufacturer | Cml Microcircuits |
|---|---|
| Manufacturer's Part Number | FX604D4 |
| Description | MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; |
| Datasheet | FX604D4 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 2.67 mm |
| Sub-Category: | Modems |
| Surface Mount: | YES |
| Maximum Supply Current: | .0025 mA |
| Terminal Finish: | Matte Tin (Sn) |
| No. of Terminals: | 16 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| Data Rate: | .0012 Mbps |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | SOP |
| Width: | 7.49 mm |
| Telecom IC Type: | MODEM |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOP16,.4 |
| Length: | 10.26 mm |
| Additional Features: | HALF DUPLEX |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/5 |
