Boyd - 323005B00000G

Boyd 577002B00000G Heat Sink has Thermal Resistance of 32Ω, U Profile with Height 19.05mm, and Longitudinal Fin Orientation. Ideal for cooling electronic components in compact spaces due to its small dimensions and efficient heat dissipation capabilities.

HEAT SINK;

HEAT SINK;

HEAT SINK;

Boyd's 552844B00000G Heat Sink has a Thermal Resistance of 8.7 ohm, Height of 18.29mm, and Width of 45.2mm. Ideal for cooling electronic components in various applications due to its anodized finish and aluminum construction.

HEAT SINK;

HEAT SINK; Device Used On: IC; Construction: FIN; Finish: BLACK ANODIZED; Height: 10 mm; Length: 31 mm;

Ohmite's WA-T247-101E heat sink has thermal resistance of 11Ω, height 30.5mm, and length 23.1mm. Ideal for transistors, this extruded aluminum alloy clip-on heat sink with longitudinal fin orientation is anodized black and weighs 12g.

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: SLIDE ON; Fin Orientation: FOLDEDBACK; Thermal Resistance: 21.6 ohm;

ICKBGA35X35 by Fischer Elektronik & Kg is a 6mm tall, black anodized heat sink with fin construction. It measures 35mm in width and length, designed for IC devices to dissipate heat efficiently. Ideal for electronic applications requiring compact cooling solutions.

HEAT SINK; Profile: U; Body Material: COPPER; Fin Orientation: TRANSVERSE; Height: 17.78 mm; Width: 9.52 mm;

HEAT SINK;

HEAT SINK; Device Used On: TRANSISTOR; Construction: U; Width: 11 mm; Height: 25 mm; Length: 16 mm;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Fin Orientation: RADIAL; Color: BLACK; Height: 50 mm;

HEAT SINK;

258 by Wakefield Thermal Solutions is a black anodized aluminum heat sink with U profile, measuring 12.7mm x 6.4mm x 8.6mm and weighing 0.82g. Ideal for cooling electronic components in compact devices due to its small size and lightweight design.

HEAT SINK;

FK220SA220 by Fischer Elektronik & Kg is a 25 ohm heat sink with dimensions of 25mm x 7mm x 20.5mm, made of anodized aluminum alloy. It is designed for transistors to efficiently dissipate heat in electronic devices, offering a black finish and transverse fin orientation for optimal thermal performance.

HEAT SINK; Body Material: ALUMINUM ALLOY; Device Used On: SEMICONDUCTOR; Construction: EXTRUDED; Fin Orientation: FIN PIN; Width: 12.7 mm;

FK24413D2PAK by Fischer Elektronik & Kg is a copper heat sink measuring 26x13x10mm and weighing 3.6g. Primarily used on ICs, it efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability.