Analog Devices - HMC520LC4TR

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: SOP8,.25;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Construction: COMPONENT;

IMAGE REJECTION; JESD-609 Code: e4; Maximum Conversion Loss: 11 dB; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 33000 MHz; Construction: COMPONENT;

DOUBLE BALANCED; Construction: COMPONENT; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2500 MHz; Maximum Input Power (CW): 10 dBm; Minimum Operating Frequency: 500 MHz;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Temperature: -55 Cel;

TRIPLE BALANCED; Screening Level: 38535V;34K;Cls S ; Maximum Input Power (CW): 15.5 dBm; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Package Equivalence Code: DIE OR CHIP;

DOUBLE BALANCED; Maximum Conversion Loss: 13 dB; Maximum Operating Temperature: 85 Cel; Terminal Finish: GOLD OVER NICKEL; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: CERAMIC; Technology: GAAS; Maximum Supply Current: 3 mA;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Maximum Operating Frequency: 30000 MHz; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Power Supplies (V): 2/5; Maximum Conversion Loss: 12 dB; Package Equivalence Code: DIE OR CHIP; Construction: COMPONENT; Maximum Operating Frequency: 36000 MHz;

DOUBLE BALANCED; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb);

TRIPLE BALANCED; Maximum Conversion Loss: 16 dB; Maximum Operating Frequency: 40000 MHz; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Maximum Input Power (CW): 13 dBm;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Frequency: 1700 MHz;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Maximum Operating Frequency: 30000 MHz; Construction: COMPONENT;

RF/Microwave Mixers; Technology: GAAS; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -55 Cel; Power Supplies (V): 5; Maximum Operating Temperature: 125 Cel;

DOUBLE BALANCED; Construction: COMPONENT; Terminal Finish: Gold (Au) - with Nickel (Ni) barrier; Maximum Input Power (CW): 20 dBm; Minimum Operating Frequency: 3000 MHz; JESD-609 Code: e4;

TRIPLE BALANCED;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Temperature: -40 Cel;

RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 14; Package Body Material: CERAMIC; Technology: BIPOLAR; Package Equivalence Code: DIP14,.3;