Analog Devices - HMC292ALC3BTR

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: SOP8,.4;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Frequency: 10000 MHz;

DOUBLE BALANCED; Construction: COMPONENT; Maximum Input Power (CW): 25 dBm; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Maximum Conversion Loss: 15 dB;

DOUBLE BALANCED;

LTC5562IUC#TRMPBF by Analog Devices is a RF/Microwave Mixer with 10 terminals, operating from 0.03 MHz to 7000 MHz. It has a max input power of 15 dBm and operates at temperatures ranging from -40°C to 105°C. Ideal for applications requiring double balanced RF or microwave devices in surface mount construction.

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Temperature: -40 Cel;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Supply Current: 265 mA;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: TSSOP8,.19;

Analog Devices' HMC528LC4TR is a GAAS technology RF/Microwave Mixer with 24 terminals. It operates b/w -40°C to 85°C, featuring image rejection capability. The ceramic package and surface mounting make it ideal for various RF applications.

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 5; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Characteristic Impedance: 50 ohm;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; JESD-609 Code: e3;

IMAGE REJECTION; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm; Construction: COMPONENT; Maximum Operating Frequency: 8500 MHz; Minimum Operating Temperature: -40 Cel;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Supply Current: 168 mA;

TRIPLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Construction: COMPONENT;

DOUBLE BALANCED; Technology: GAAS; Maximum Operating Temperature: 85 Cel; Maximum Supply Current: 210 mA; Package Equivalence Code: DIE OR CHIP; Power Supplies (V): 3;

SINGLE BALANCED; Maximum Operating Temperature: 85 Cel; Minimum Operating Frequency: 3000 MHz; Terminal Finish: Tin/Lead (Sn/Pb); Minimum Operating Temperature: -40 Cel; Maximum Operating Frequency: 3800 MHz;