Analog Devices - HMC129

DOUBLE BALANCED; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb);

Analog Devices' HMC553ALC3BTR is a RF/Microwave Mixer with 12 terminals, operating from -40 to 85°C. Featuring GaAs technology, it has a frequency range of 6-14 GHz and conversion loss of 10 dB. Ideal for applications requiring double balanced mixers in the 50 ohm impedance range.

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2500 MHz; Construction: COMPONENT;

DOUBLE BALANCED; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Minimum Operating Frequency: 700 MHz; Maximum Input Power (CW): 20 dBm; Minimum Operating Temperature: -40 Cel;

IMAGE REJECTION; Maximum Input Power (CW): 18 dBm; Construction: COMPONENT; Maximum Operating Temperature: 85 Cel; Maximum Operating Frequency: 27000 MHz; Characteristic Impedance: 50 ohm;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Maximum Supply Current: 265 mA;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 14; Package Body Material: CERAMIC; Technology: BIPOLAR; Package Equivalence Code: DIP14,.3;

RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 14; Package Body Material: CERAMIC; Technology: BIPOLAR; Screening Level: MIL-STD-883 Class B (Modified);

TRIPLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -40 Cel;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 3; Maximum Operating Temperature: 85 Cel;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Frequency: 8000 MHz;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -40 Cel;

RF/Microwave Mixers; Technology: GAAS; Package Equivalence Code: DIE OR CHIP;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Construction: COMPONENT;

DOUBLE BALANCED; Technology: GAAS; Maximum Operating Frequency: 32000 MHz; Package Equivalence Code: DIE OR CHIP; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 18000 MHz;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Power Supplies (V): 5;

TRIPLE BALANCED; Maximum Input Power (CW): 17 dBm; Construction: COMPONENT; Maximum Conversion Loss: 14 dB; Minimum Operating Temperature: -55 Cel; Minimum Operating Frequency: 15000 MHz;