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| Manufacturer | Alliance Memory |
|---|---|
| Manufacturer's Part Number | AS4C64M16D2A-25BCN |
| Description | DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; |
| Datasheet | AS4C64M16D2A-25BCN Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 64MX16 |
| Maximum Time At Peak Reflow Temperature (s): | 20 |
| Maximum Seated Height: | 1.2 mm |
| Access Mode: | MULTI BANK PAGE BURST |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 84 |
| No. of Words: | 67108864 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B84 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 8 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| No. of Ports: | 1 |
| Memory Density: | 1073741824 bit |
| Self Refresh: | YES |
| Memory IC Type: | DDR2 DRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Length: | 12.5 mm |
| No. of Words Code: | 64M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | AUTO/SELF REFRESH |
| Peak Reflow Temperature (C): | 265 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.9 V |
