Telephone Line ICs
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Repertory | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | Crystal Frequency (MHz) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Make-break Ratio | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.2 mA |
3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
1:2 |
17.9 mm |
|||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 2:1 |
3:2 |
35.5 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE SPEECH CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.7 V |
SMALL OUTLINE |
1.27 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE SPEECH CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
2.8 V |
SMALL OUTLINE |
1.27 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
12.8 mm |
||||||||||||||
|
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G8 |
2.65 mm |
7.5 mm |
Not Qualified |
40 |
260 |
7.55 mm |
|||||||||||||
|
NXP Semiconductors |
SPEAKER PHONE CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.35 V |
FLATPACK |
.8 mm |
75 Cel |
-25 Cel |
QUAD |
S-PQFP-G44 |
2.1 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
Not Qualified |
e3/e4 |
3:2 |
26.73 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
COMMERCIAL |
GULL WING |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G32 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
2:3 |
20.5 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.9 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 1:3 |
1:1 |
10.3 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.9 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
1:1.5 |
17.9 mm |
|||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
||||||||||||||||
|
|
NXP Semiconductors |
TELEPHONE SPEECH CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
2.7 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T16 |
1 |
4.32 mm |
7.62 mm |
Not Qualified |
e4 |
38.1 mm |
|||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.6 mA |
5 V |
1.8/6 |
SMALL OUTLINE |
SOP28,.4 |
Telephone Circuits |
1.27 mm |
70 Cel |
REPERTORY |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 3:2 |
3.58 |
2:1 |
17.9 mm |
||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
.9 mA |
5 V |
3/5 |
IN-LINE |
DIP20,.3 |
Telephone Circuits |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
Not Qualified |
3.58 |
1:2 |
26.73 mm |
||||||||||
|
NXP Semiconductors |
SPEAKER PHONE CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G24 |
2 mm |
5.3 mm |
Not Qualified |
8.2 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.4 mA |
3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 1:2 |
1:1.5 |
12.8 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE |
1.27 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
2:3 |
17.9 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
1.6 mA |
5 V |
1.8/6 |
IN-LINE |
DIP28,.6 |
Telephone Circuits |
2.54 mm |
70 Cel |
REPERTORY |
-25 Cel |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 3:2 |
3.58 |
2:1 |
35.5 mm |
||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 2:1 |
e4 |
3:2 |
17.9 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G8 |
2.86 mm |
7.55 mm |
Not Qualified |
7.75 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 2:1 |
e4 |
3:2 |
17.9 mm |
|||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.2 mA |
3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
1:2 |
17.9 mm |
|||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 3:2 |
2:1 |
17.9 mm |
|||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 2:1 |
e4 |
3:2 |
12.8 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
NO LEAD |
18 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
.4 mA |
3 V |
UNCASED CHIP |
70 Cel |
-25 Cel |
UPPER |
X-XUUC-N18 |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 1:2 |
1:1.5 |
||||||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE |
1.27 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
2:3 |
17.9 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.9 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
1:2 |
12.8 mm |
|||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP28,.4 |
Telephone Circuits |
1.27 mm |
70 Cel |
REPERTORY |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 3:2 |
3.58 |
2:1 |
17.9 mm |
||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
.4 mA |
3 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T18 |
4.7 mm |
7.62 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 1:2 |
1:1.5 |
21.6 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
1.8 mA |
5 V |
3/5 |
IN-LINE |
DIP28,.6 |
Telephone Circuits |
2.54 mm |
70 Cel |
REPERTORY |
-25 Cel |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 3:2 |
3.58 |
2:1 |
35.5 mm |
||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
1.2 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T8 |
4.2 mm |
7.62 mm |
Not Qualified |
|||||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE |
1.27 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
2:3 |
17.9 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
TIN/NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 2:1 |
e3/e4 |
3:2 |
35.5 mm |
|||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
.4 mA |
3 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-GDIP-T18 |
5.08 mm |
7.62 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 1:2 |
1:1.5 |
|||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 2:1 |
e4 |
3:2 |
17.9 mm |
|||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
.4 mA |
3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G20 |
2.65 mm |
7.5 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 1:2 |
1:1.5 |
12.8 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE RINGER CIRCUIT |
OTHER |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.14 mA |
6 V |
6 |
SMALL OUTLINE |
SOP16,.4 |
Telephone Circuits |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G16 |
2.65 mm |
7.5 mm |
Not Qualified |
10.3 mm |
||||||||||||
|
|
NXP Semiconductors |
TELEPHONE SPEECH CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
2.7 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
TIN |
DUAL |
R-PDIP-T16 |
4.32 mm |
7.62 mm |
Not Qualified |
e3 |
38.1 mm |
||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.9 mA |
5 V |
3/5 |
SMALL OUTLINE |
SOP28,.4 |
Telephone Circuits |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
3.58 |
1:1.5 |
17.9 mm |
||||||||||
|
NXP Semiconductors |
SPEAKER PHONE CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
5 V |
SMALL OUTLINE, SHRINK PITCH |
.65 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G24 |
2 mm |
5.3 mm |
Not Qualified |
8.2 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDSO-G8 |
2.86 mm |
7.55 mm |
Not Qualified |
7.75 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
.2 mA |
3 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
Not Qualified |
1:2 |
26.73 mm |
|||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
2 mA |
3.3 V |
3.3 |
IN-LINE |
DIP28,.6 |
Telephone Circuits |
2.54 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
35.5 mm |
|||||||||||||
|
NXP Semiconductors |
TELEPHONE RINGER CIRCUIT |
OTHER |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
.12 mA |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T16 |
4.7 mm |
7.62 mm |
Not Qualified |
|||||||||||||||||
|
NXP Semiconductors |
TELEPHONE MULTIFUNCTION CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
SMALL OUTLINE |
1.27 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.5 mm |
Not Qualified |
2:3 |
17.9 mm |
||||||||||||||||
|
NXP Semiconductors |
TELEPHONE DIALER CIRCUIT |
OTHER |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
-25 Cel |
DUAL |
R-PDIP-T28 |
5.1 mm |
15.24 mm |
Not Qualified |
SELECTABLE MAKE/BREAK RATIO 1:2 |
1:1.5 |
||||||||||||||||
|
|
NXP Semiconductors |
TELEPHONE SPEECH CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BIPOLAR |
2.8 V |
IN-LINE |
2.54 mm |
75 Cel |
-25 Cel |
DUAL |
R-PDIP-T20 |
4.2 mm |
7.62 mm |
Not Qualified |
40 |
245 |
26.73 mm |
Telephone Line ICs are electronic components used in telephone systems to interface with the telephone line and provide necessary functionality for telephone communication. These ICs are designed to provide reliable and efficient operation of the telephone line, allowing for clear and uninterrupted communication between two devices.
Telephone Line ICs use various techniques to interface with the telephone line, including pulse dialing, dual-tone multi-frequency (DTMF) signaling, and loop current sensing. Pulse dialing is used to send a series of electrical pulses over the telephone line to dial a phone number. DTMF signaling is used to send a sequence of tones to control various telephone functions, such as call forwarding and call waiting. Loop current sensing is used to detect the presence of a telephone off-hook condition, allowing the telephone system to provide appropriate signaling and call management.
Some common features of Telephone Line ICs include:
1. Telephone line interface: Telephone Line ICs provide the necessary interface with the telephone line to enable telephone communication.
2. Signal processing: Telephone Line ICs are designed to process signals quickly and efficiently, ensuring clear and uninterrupted communication.
3. Tone generation and detection: Telephone Line ICs can generate and detect various tones used for telephone communication, such as dial tones and busy signals.
4. Call management: Telephone Line ICs can provide call management functions, such as call waiting and call forwarding.
Telephone Line ICs are used in a variety of telephone systems, including traditional landline phones, cordless phones, and PBX (Private Branch Exchange) systems. They are also used in other communication systems that require telephone line interface, such as alarm systems and security systems.