Microchip Technology ATM/SONET/SDH Circuits 23
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Applications | Surface Mount | No. of Functions | No. of Channels | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Microchip Technology |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SONET |
YES |
1 |
205 mA |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.31SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N68 |
.8 mm |
8 mm |
e3 |
8 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH SERIAL TO PARALLEL/PARALLEL TO SERIAL CONVERTER |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SONET |
YES |
1 |
205 mA |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.31SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N68 |
.8 mm |
8 mm |
e3 |
8 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
78 mA |
1.8 V |
FLATPACK, THIN PROFILE, FINE PITCH |
SPQFP64,.48SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
e3 |
10 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
1.8 V |
GRID ARRAY, FINE PITCH |
BGA100,10X10,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
1.72 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
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|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
GRID ARRAY, FINE PITCH |
BGA100,10X10,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
1.72 mm |
9 mm |
e1 |
9 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY |
BGA144(UNSPEC) |
95 Cel |
BOTTOM |
S-PBGA-B144 |
13 mm |
13 mm |
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|
Microchip Technology |
ATM/SONET/SDH ICS |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
154 mA |
1.8 V |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B256 |
1.7 mm |
17 mm |
17 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
160 mA |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE |
TQFP32,.35SQ,32 |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
40 |
260 |
7 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT |
INDUSTRIAL |
GULL WING |
32 |
HTQFP |
SQUARE |
PLASTIC/EPOXY |
ATM; SDH; SONET |
YES |
1 |
160 mA |
3.3 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE |
TQFP32,.35SQ,32 |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1.2 mm |
7 mm |
e3 |
7 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
64 |
BGA |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
1.8 V |
GRID ARRAY |
BGA64,8X8,40 |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B64 |
1.72 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
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|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B196 |
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|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
100 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
BGA100,10X10,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
3 |
1.72 mm |
9 mm |
Not Qualified |
e1 |
30 |
260 |
9 mm |
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|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
80 |
VFLGA |
SQUARE |
UNSPECIFIED |
SONET;SDH |
YES |
1 |
1.8 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
LGA80,20X20,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XBGA-N80 |
.9 mm |
11 mm |
11 mm |
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|
Microchip Technology |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
GULL WING |
80 |
HLQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE |
QFP80,.6SQ |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
14 mm |
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|
Microchip Technology |
ATM/SONET/SDH TRANSCEIVER |
OTHER |
BALL |
244 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
GRID ARRAY |
BGA244(UNSPEC) |
90 Cel |
-5 Cel |
BOTTOM |
S-PBGA-B244 |
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|
Microchip Technology |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SDH; SONET |
YES |
1 |
43 mA |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SONET |
YES |
1 |
60 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
.9 mm |
3 mm |
e4 |
40 |
260 |
3 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH NETWORK INTERFACE |
INDUSTRIAL |
GULL WING |
80 |
HLQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE |
QFP80,.6SQ |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G80 |
1.6 mm |
14 mm |
14 mm |
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|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
BALL |
500 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY |
BOTTOM |
S-PBGA-B500 |
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|
Microchip Technology |
ATM/SONET/SDH MUX/DEMUX |
BALL |
896 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B896 |
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|
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
SONET |
YES |
1 |
60 mA |
2.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
2 |
.9 mm |
3 mm |
e4 |
40 |
260 |
3 mm |
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|
|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
10 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
SDH; SONET |
YES |
1 |
65 mA |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP10,.19,20 |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-G10 |
2 |
1.1 mm |
3 mm |
Not Qualified |
e4 |
40 |
260 |
3 mm |
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|
Microchip Technology |
ATM/SONET/SDH SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
SONET;SDH |
YES |
1 |
242 mA |
1.8 V |
GRID ARRAY |
BGA144,12X12,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B144 |
1.95 mm |
13 mm |
13 mm |
ATM (Asynchronous Transfer Mode), SONET (Synchronous Optical Network), and SDH (Synchronous Digital Hierarchy) circuits are high-speed communication technologies used in telecommunications networks.
ATM is a cell-based network technology that enables high-speed data transfer, video and voice communication. It divides data into fixed-size cells and sends them across the network using time-division multiplexing (TDM).
SONET and SDH are both standard protocols for optical telecommunications transport. They use synchronous timing signals to enable high-speed communication over fiber optic networks. SONET is used primarily in North America, while SDH is used primarily in Europe and other regions.
ATM, SONET, and SDH circuits offer several advantages over other communication technologies. They provide high-speed communication with low latency, allowing for efficient data transfer and real-time voice and video communication. They also provide a high level of reliability and fault tolerance, making them ideal for use in mission-critical applications such as banking, healthcare, and defense.
However, these circuits also require specialized hardware and software, and can be more expensive to implement and maintain than other communication technologies. They also require a high level of expertise to configure and manage.