Multi-functional Peripherals | Vyrian

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Ultraviolet Erasable	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	ROM Bits Size	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
CY8C5688AXI-LP099T	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		0			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz			14 mm			CMOS		3.3 V				CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB	.5 mm	S-PQFP-G100					62
CY8C4025AZI-S403T	Infineon Technologies		INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V					FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		2048	7 mm		NO		48 MHz			7 mm			CMOS		3.3 V				I2C; SPI; UART	.5 mm	S-PQFP-G48	3				36
CY8C4125FNI-483	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	35	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA35,5X7,16	1.71 V	85 Cel		-40 Cel			BOTTOM	.55 mm		2048	2.1 mm		NO	0	24 MHz			3.23 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.4 mm	R-PBGA-B35					31
CY8C4125AXI-M445T	Infineon Technologies																				NICKEL PALLADIUM GOLD																									3			e4
CY8C20334-12LKXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		0	8	2.7/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	2.4 V	85 Cel	M8C	-40 Cel	MATTE TIN		QUAD	.6 mm	8192	512	4 mm		NO	0	12 MHz	20	260	4 mm		512	CMOS	2.5 mA	3 V		Microcontrollers	FLASH	USB	.5 mm	S-XQCC-N24	3	Not Qualified	12 rpm	e3
CY8C4146AZI-S455	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			PURE TIN																									3
CY8C4128FNI-BL553T	Infineon Technologies		INDUSTRIAL	BALL	76	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		BOTTOM	.55 mm		16384	3.87 mm		NO	0	48 MHz			4.04 mm			CMOS		1.8 V				I2C; SPI; UART	.4 mm	R-PBGA-B76	1			e4	36
CY8C4147AZI-S463	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			PURE TIN																									3
CY8C3866PVI-070T	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		0		2/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	DUAL	2.794 mm		4096	7.505 mm		YES	0	67 MHz			15.875 mm	65536 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2; 8051	.635 mm	R-PDSO-G48	3	Not Qualified		e4	29
CY8C6347BZI-BLD33T	Infineon Technologies
CY8C4127AZQ-S455	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			PURE TIN																									3
CY8C3444PVA-100	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100			1.8/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	85 Cel		-40 Cel	MATTE TIN	N	DUAL	2.794 mm		1024	7.5057 mm		YES		33 MHz			15.875 mm	131072 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2; 8051	.635 mm	R-PDSO-G48	3	Not Qualified		e3	29
CY8C5668AXI-LP010T	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		0			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz			14 mm			CMOS		3.3 V				I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB	.5 mm	S-PQFP-G100					62
CY8C4125PVQ-482	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	1.71 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2 mm		2048	5.3 mm		NO	0	24 MHz			10.2 mm			CMOS	7.2 mA	1.8 V	0			I2C, I2S, SPI, UART	.65 mm	R-PDSO-G28	3			e4	24
CY8C5888LTI-LP097T	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		32768	8 mm		YES	0	33 MHz	30	260	8 mm			CMOS		3.3 V				I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS	.4 mm	S-XQCC-N68	3			e4	38
CY8C20534-12PVXIT	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		0	8	2.7/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	3 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	2 mm	8192	512	5.3 mm	IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ	NO	0	12 MHz	30	260	10.2 mm		512	CMOS	2.5 mA	4.75 V		Microcontrollers	FLASH	USB	.65 mm	R-PDSO-G28	3	Not Qualified	12 rpm	e3	24
CY8C5867LTI-LP028T	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD	1 mm		16384	8 mm		YES	0	33 MHz	30	260	8 mm			CMOS		3.3 V				I2C; I2S; LIN; PS/2; SPI; UART; USB; SIO; IDE; SMBUS	.4 mm	S-XQCC-N68	3			e4	38
CY8C4126AZA-M445T	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			PURE TIN																									3
CY8C4126AXI-S445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		0			FLATPACK, LOW PROFILE		1.71 V	85 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		4096	14 mm		NO	0	48 MHz			14 mm			CMOS		3.3 V				I2C; SPI; UART	.8 mm	S-PQFP-G64	3				54
CY8C5667LTI-LP008	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V				2/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.71 V	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	N	QUAD	1 mm		16384	8 mm		YES		33 MHz	30	260	8 mm	1048576 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.4 mm	S-XQCC-N68	3	Not Qualified		e4	48
CY8C24794-24LTXIT	Infineon Technologies		INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		0	8	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	4.75 V	85 Cel	M8C	-40 Cel	MATTE TIN		QUAD	1 mm	16384	512	8 mm	IT ALSO OPERATES AT 3 V MINIMUM SUPPLY	NO	0	24 MHz	20	260	8 mm		1024	CMOS	27 mA	5 V		Microcontrollers	FLASH	I2C; USB	.5 mm	S-XQCC-N56	3	Not Qualified	24.96 rpm	e3	50
CY8C4125AXI-M445	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V					FLATPACK, LOW PROFILE	QFP64,.63SQ,32	1.8 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		2048	14 mm		NO		48 MHz			14 mm			CMOS	7.2 mA		7			I2C; IRDA; LIN; SPI; UART	.8 mm	S-PQFP-G64	3			e4	51
CY8C3246PVI-122T	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		0		1.8/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	N	DUAL	2.794 mm		4096	7.505 mm		YES	0	33 MHz			15.875 mm	524288 Bits		CMOS		3.3 V		Other uPs/uCs/Peripheral ICs		8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART	.635 mm	R-PDSO-G48	3	Not Qualified		e4	25
CY8C29666-12PVXET	Infineon Technologies		AUTOMOTIVE	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.25 V		0	8	5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	4.75 V	125 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		DUAL	2.794 mm	32768	1024	7.5 mm		NO	0	24.24 MHz	20	260	15.875 mm		2048	CMOS	15 mA	5 V		Microcontrollers	FLASH		.635 mm	R-PDSO-G48	3	Not Qualified	12 rpm	e4	44
CY8C5668AXI-LP013	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V				2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel		-40 Cel	MATTE TIN	N	QUAD	1.6 mm		32768	14 mm		YES		33 MHz	30	260	14 mm	2097152 Bits		CMOS		1.8 V		Other uPs/uCs/Peripheral ICs		I2C; USB; PS/2	.5 mm	S-PQFP-G100	3	Not Qualified		e3	72
CY8C3666AXI-036	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		0	8	2/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.71 V	85 Cel	8051	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm	65536	4096	14 mm		YES	0	67 MHz	40	260	14 mm		8192	CMOS		3.3 V		Microcontrollers	FLASH	I2C; USB	.5 mm	S-PQFP-G100	3	Not Qualified	67 rpm	e4	62
CY8C20566A-24PVXAT	Infineon Technologies		INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100		8	1.8/5	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	1.71 V	85 Cel	M8C	-40 Cel	MATTE TIN		DUAL	2.794 mm	32768	1024	7.5057 mm		NO		25.2 MHz			15.875 mm		2048	CMOS	4 mA	3 V		Microcontrollers	FLASH	I2C	.635 mm	R-PDSO-G48	3	Not Qualified	25.2 rpm	e3	34
CY8C5467LTI-LP003T	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	1 mm		16384	8 mm		YES	0	33 MHz			8 mm			CMOS		3.3 V				I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB	.4 mm	S-XQCC-N68					38
CY8C4245AZS-M445T	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			PURE TIN																									3
CY8C4247FNI-BL473T	Infineon Technologies		INDUSTRIAL	BALL	68	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.89 V		0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	.55 mm		8192	3.52 mm		NO	0	48 MHz	30	260	3.91 mm			CMOS		1.8 V				I2C; I2S; SPI; UART	.4 mm	R-PBGA-B68	1			e1	36
CY8C24193-24LQXI	Infineon Technologies		INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V			8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.71 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192	512	5 mm		NO		25.2 MHz	30	260	5 mm		1024	CMOS	4 mA	1.8 V		Microcontrollers	FLASH	I2C; USB; LPC	.5 mm	S-XQCC-N32	3	Not Qualified	24 rpm	e4	28
CY8C4014FNI-421A	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,14	1.8 V	85 Cel		-40 Cel			BOTTOM	.42 mm		1024	1.472 mm		NO		16 MHz			1.579 mm			CMOS	4.5 mA	3.3 V				I2C	.35 mm	R-PBGA-B16					12
CY8C4245AXQ-483	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V					FLATPACK, LOW PROFILE	QFP44,.47SQ,32	1.71 V	105 Cel		-40 Cel	PURE TIN		QUAD	1.6 mm		2048	10 mm		NO		48 MHz			10 mm			CMOS	13.8 mA	3.3 V	3			I2C; IDE; IRDA; LIN; SPI; UART	.8 mm	S-PQFP-G44	3				36
CY8C4124PVA-442ZT	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	0			SMALL OUTLINE, SHRINK PITCH		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		DUAL	2 mm		2048	5.3 mm		NO	0	24 MHz			10.2 mm			CMOS		1.8 V				I2C; SPI; UART	.65 mm	R-PDSO-G28	3			e4	24
CY8C6347BZI-BLD43T	Infineon Technologies																				TIN SILVER COPPER																									3			e1
CY8C4245PVS-452Z	Infineon Technologies																				NICKEL PALLADIUM GOLD SILVER																									3			e4
CY8C4247LTQ-M475	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	68	HQCCN	SQUARE	UNSPECIFIED	YES	5.5 V					CHIP CARRIER, HEAT SINK/SLUG	LCC68,.32SQ,16	1.71 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		8192	8 mm		NO		48 MHz			8 mm			CMOS	13.8 mA		11			I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3			e4	55
CY8C4248BZI-L469	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.8 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM	1 mm		16384	9 mm		NO		48 MHz			9 mm			CMOS	14.5 mA					I2C; IRDA; LIN; SPI; UART; USB	.65 mm	S-PBGA-B124	3			e1	98
CY8C4247LWS-M484T	Infineon Technologies	MULTIFUNCTION PERIPHERAL																			NICKEL PALLADIUM GOLD SILVER											30	260													3			e4
CY8C20434-12LQXI	Infineon Technologies		INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		0	8	2.7/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	3 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	.6 mm	8192	512	5 mm	IT ALSO OPERATES MINIMUM SUPPLY 2.4 V AT 750 KHZ	NO	0	12 MHz	40	260	5 mm		512	CMOS	2.5 mA	4.75 V		Microcontrollers	FLASH	USB	.5 mm	S-XQCC-N32	3	Not Qualified	12 rpm	e4	28
CY8C28643-24LTXIT	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	5.25 V		0	8	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	4.75 V	85 Cel	M8C	-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm	16384	1024	7 mm	ALSO OPERATES AT 3V MINIMUM SUPPLY	NO	0	24 MHz	20	260	7 mm		1024	CMOS	14 mA	5 V		Microcontrollers	FLASH	I2C, IRDA, SPI, UART, USB	.5 mm	S-XQCC-N48	3	Not Qualified	24 rpm	e4	44
CY8C4246LTI-DM405	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1 mm		8K	8 mm		NO	0	48 MHz			8 mm			CMOS		3.3 V				I2C; SPI; UART; IRDA; IDE; LIN	.4 mm	S-XQCC-N68	3			e4	55
CY8C20534-12PVXA	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				8	2.7/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3		85 Cel	M8C	-40 Cel			DUAL		8192											512	CMOS	2.5 mA			Microcontrollers	FLASH		.635 mm	R-PDSO-G28		Not Qualified	12 rpm
CY8C4125PVS-482ZT	Infineon Technologies		INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V	AEC-Q100	0			SMALL OUTLINE, SHRINK PITCH		1.71 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD SILVER		DUAL	2 mm		2048	5.3 mm		NO	0	24 MHz			10.2 mm			CMOS		1.8 V				I2C; SPI; UART	.65 mm	R-PDSO-G28	3			e4	24
CY8C5888AXQ-LP096T	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		0			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz	30	260	14 mm			CMOS		3.3 V				I2C; I2S; LIN; PS/2; SPI; UART; USB; CAN; SIO; IDE; SMBUS	.5 mm	S-PQFP-G100	3			e4	62
CY8C4A45FNI-483	Infineon Technologies	MULTIFUNCTION PERIPHERAL	INDUSTRIAL	BALL	45	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		0			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA45,9X5,15	1.71 V	85 Cel		-40 Cel			BOTTOM	.482 mm		4096	1.986 mm		NO	0	48 MHz			3.691 mm			CMOS	25 mA	3.3 V				I2C; IDE; IRDA; LIN; SPI; UART	.38 mm	R-PBGA-B45					37
CY8C5668AXI-LP013T	Infineon Technologies		INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		0			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	85 Cel		-40 Cel			QUAD	1.6 mm		32768	14 mm		YES	0	33 MHz			14 mm			CMOS		3.3 V				CAN; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB	.5 mm	S-PQFP-G100					62
CY8C5266LTI-LP150T	Infineon Technologies		INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		0			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.71 V	85 Cel		-40 Cel			QUAD	1 mm		8192	8 mm		YES	0	33 MHz			8 mm			CMOS		3.3 V				I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART	.4 mm	S-XQCC-N68					38

Multi-functional Peripherals

Multi-functional peripherals (MFPs) are devices that combine several different functions, such as printing, scanning, copying, and faxing, into a single piece of equipment. These devices are often used in office settings to streamline workflows and reduce the need for multiple pieces of equipment.

MFPs typically come with a range of features and capabilities, including high-quality printing and scanning, fast copying and faxing, and the ability to handle large volumes of documents. They may also offer additional features, such as double-sided printing, wireless connectivity, and cloud-based printing and scanning.

One of the key benefits of MFPs is their ability to save space and reduce clutter in an office environment. By combining several different functions into a single device, MFPs eliminate the need for separate printers, scanners, copiers, and fax machines, freeing up valuable space and reducing costs.

In addition to their space-saving benefits, MFPs also offer enhanced efficiency and productivity. With the ability to print, scan, copy, and fax all from a single device, users can complete tasks quickly and easily, without the need to switch between different pieces of equipment.