Part | RoHS | Manufacturer | Oscillator Type | Mounting Feature | No. of Terminals | Frequency Stability | Frequency Adjustment (Mechanical) | Aging | Package Body Material | Maximum Supply Voltage | Technology | Screening Level | Output Load | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Equivalence Code | Maximum Rise Time | Sub-Category | Physical Dimension | Minimum Supply Voltage | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Nominal Operating Frequency | Maximum Fall Time | Maximum Symmetry (%) | Manufacturer Series | Qualification | Maximum Output Low Current | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
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|
Microchip Technology |
HCSL |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
50 OHM |
.45 ms |
5.0mm x 3.2mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
156.25 MHz |
.45 ns |
52/48 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e3 |
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|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
5.0mm x 3.2mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
148.5 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e3 |
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|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
.5 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
212.5 MHz |
.5 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR |
e3 |
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|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
125 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e3 |
|||||||||||||||
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
148.5 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
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|
Microchip Technology |
LVPECL |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
50 OHM |
7.1mm x 5.1mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
100 MHz |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TUBE |
e4 |
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|
Microchip Technology |
LVPECL |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
50 OHM |
7.1mm x 5.1mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
100 MHz |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR |
e4 |
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|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
50 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e3 |
|||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
50 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e3 |
|||||||||||||||
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
2.625 V |
100 OHM |
2.5 V |
.4 ms |
7.0mm x 5.0mm x 1.7mm |
2.375 V |
85 Cel |
-40 Cel |
TIN LEAD |
24.54 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT |
e0 |
||||||||||||||||
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
2.625 V |
100 OHM |
2.5 V |
.4 ms |
7.0mm x 5.0mm x 1.7mm |
2.375 V |
85 Cel |
-40 Cel |
66.667 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE |
||||||||||||||||||
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
2.625 V |
100 OHM |
2.5 V |
.4 ms |
7.0mm x 5.0mm x 1.7mm |
2.375 V |
85 Cel |
-40 Cel |
TIN LEAD |
66.667 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT |
e0 |
||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
CERAMIC |
2.625 V |
100 OHM |
14 mA |
2.5 V |
DILCC6,.2 |
.4 ms |
7mm x 5mm x 1.7mm |
2.375 V |
70 Cel |
-10 Cel |
GOLD OVER NICKEL |
125 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
|||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
7 mA |
3.3 V |
DILCC4,.12 |
6 ms |
5.0mm x 3.2mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
5 MHz |
6 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
CERAMIC |
3.63 V |
15 pF |
7 mA |
3.3 V |
DILCC4,.12 |
6 ms |
5.0mm x 3.2mm x 1.4mm |
2.97 V |
105 Cel |
-40 Cel |
8 MHz |
6 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||
Microchip Technology |
CMOS |
SURFACE MOUNT |
20 % |
NO |
3.45 V |
15 pF |
3.3 V |
4 ms |
3.2mm x 2.5mm x 1.2mm |
3.15 V |
85 Cel |
-40 Cel |
12 MHz |
4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TAPE |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
CERAMIC |
3.465 V |
100 OHM |
33 mA |
3.3 V |
LCC6,.1X.12,60/47 |
.5 ms |
3.2mm x 2.5mm x 1.2mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
125 MHz |
.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; DIFFERENTIAL OUTPUT |
e4 |
|||||||||||
Microchip Technology |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.45 V |
15 pF |
3.3 V |
5 ms |
2.5mm x 2.0mm x 0.8mm |
3.15 V |
85 Cel |
-40 Cel |
40 MHz |
5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE |
||||||||||||||||||
Microchip Technology |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.45 V |
15 pF |
3.3 V |
5 ms |
2.5mm x 2.0mm x 0.8mm |
3.15 V |
85 Cel |
-40 Cel |
50 MHz |
5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE |
||||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.63 V |
15 pF |
20 mA |
3.3 V |
DILCC4,.12 |
4 ms |
5mm x 3.2mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
24.576 MHz |
4 ns |
45/55 |
8 Amp |
TRI-STATE |
e4 |
|||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
CERAMIC |
3.465 V |
100 OHM |
60 mA |
3.3 V |
3.3 |
DILCC6,.2 |
.6 ms |
Other Oscillators |
7.0mm x 5.0mm x 1.6mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
100 MHz |
.6 ns |
55/45 |
Not Qualified |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
||||||||
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
37.4642 MHz |
6 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.
One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.
XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.
Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.