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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Output Enable	Maximum Standby Current	Length	Maximum Access Time
IDT72801L15PFI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	2	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	256 words	5	5	9	FLATPACK, LOW PROFILE	QFP64,.6SQ,32	FIFOs	.8 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	2304 bit	4.5 V		e0	30	240	YES	.01 Amp	14 mm	10 ns
IDT72801L15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	2	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	256 words	5	5	9	FLATPACK, LOW PROFILE	QFP64,.6SQ,32	FIFOs	.8 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	2304 bit	4.5 V		e0	30	240	YES	.01 Amp	14 mm	10 ns
IDT72801L35PF	Integrated Device Technology	OTHER FIFO	COMMERCIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	35 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	270 mA	512 words	5	5	9	FLATPACK, LOW PROFILE	QFP64,.66SQ,32	FIFOs	.8 mm	70 Cel	3-STATE	512X9	512	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	5.5 V	1.6 mm	28.6 MHz	14 mm	Not Qualified	4608 bit	4.5 V		e0	30	240	YES	.01 Amp	14 mm	20 ns
IDT7280L15PA	Integrated Device Technology	OTHER FIFO	COMMERCIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	2	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	125 mA	256 words	5	5	9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	FIFOs	.5 mm	70 Cel	3-STATE	256X9	256	0 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G56	1	5.5 V	1.2 mm	40 MHz	6.1 mm	Not Qualified	2304 bit	4.5 V	RETRANSMIT	e0	20	240	NO		14 mm	15 ns
IDT7282L15PAI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	2	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	FIFOs	.5 mm	85 Cel		1KX9	1K	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G56	1	5.5 V	1.2 mm	40 MHz	6.1 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	20	240	NO	.015 Amp	14 mm	15 ns
IDT72V7280L10BB	Integrated Device Technology	OTHER FIFO	COMMERCIAL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	75 mA	16384 words	3.3	3.3	72	GRID ARRAY	BGA256,16X16,40	FIFOs	1 mm	70 Cel		16KX72	16K	0 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	S-PBGA-B256	3	3.45 V	3.5 mm	100 MHz	17 mm	Not Qualified	1179648 bit	3.15 V	RETRANSMIT	e0	30	225	YES	.015 Amp	17 mm	6.5 ns
IDT72V7280L10BBG	Integrated Device Technology		COMMERCIAL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS		16384 words	3.3		72	GRID ARRAY			1 mm	70 Cel		16KX72	16K	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	3.45 V	3.5 mm		17 mm	Not Qualified	1179648 bit	3.15 V	RETRANSMIT	e1	40	260	YES		17 mm	6.5 ns
72V2111L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	524288 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	FIFOs	.8 mm	85 Cel		512KX9	512K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.45 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	4718592 bit	3.15 V		e3	NOT SPECIFIED	260	YES	.02 Amp	14 mm	10 ns
72V211L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		512 words	3.3		9	FLATPACK, LOW PROFILE			.8 mm	85 Cel		512X9	512	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm		7 mm		4608 bit	3 V		e3	NOT SPECIFIED	260	YES		7 mm	10 ns
72V82L20PAGI8	Renesas Electronics	BI-DIRECTIONAL FIFO	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		1024 words	3.3		9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		1KX9	1K	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G56		3.6 V	1.2 mm		6.1 mm		9216 bit	3 V	RETRANSMIT	e3	40	260	NO		14 mm	20 ns
74HC40105D,653	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	71.428 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	4.5	2/6	4	SMALL OUTLINE	SOP16,.25	FIFOs	1.27 mm	125 Cel	3-STATE	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	1.75 mm	14 MHz	3.9 mm	Not Qualified	64 bit	2 V	REGISTER BASED; BUBBLE BACK 750NS	e4	30	260	YES		9.9 mm	600 ns
74HC40105DB,112	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	71.428 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	4.5	2/6	4	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	FIFOs	.65 mm	125 Cel		16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	2 mm	33 MHz	5.3 mm	Not Qualified	64 bit	2 V		e4	30	260	YES		6.2 mm	600 ns
74HC40105N	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	71.428 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		16 words	4.5	2/6	4	IN-LINE	DIP16,.3	FIFOs	2.54 mm	125 Cel	3-STATE	16X4	16	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		6 V	4.7 mm	14 MHz	7.62 mm	Not Qualified	64 bit	2 V	REGISTER BASED; BUBBLE BACK 750NS	e4			YES		21.6 mm	600 ns
74HC40105N,652	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	71.428 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		16 words	4.5	2/6	4	IN-LINE	DIP16,.3	FIFOs	2.54 mm	125 Cel	3-STATE	16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDIP-T16		6 V	4.7 mm	14 MHz	7.62 mm	Not Qualified	64 bit	2 V	REGISTER BASED; BUBBLE BACK 750NS	e4	30	260	YES		21.6 mm	600 ns
74HC40105PW,112	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	71.428 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	4.5	2/6	4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	FIFOs	.65 mm	125 Cel		16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	1.1 mm	33 MHz	4.4 mm	Not Qualified	64 bit	2 V		e4	30	260	YES		5 mm	600 ns
74HC40105PW,118	NXP Semiconductors		AUTOMOTIVE	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	71.428 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS		16 words	4.5		4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		16X4	16	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	1.1 mm		4.4 mm	Not Qualified	64 bit	2 V		e4	30	260	YES		5 mm	600 ns
CD74HC40105EE4	Texas Instruments	OTHER FIFO	MILITARY	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	500 ns	1	CMOS	THROUGH-HOLE	PARALLEL	SYNCHRONOUS		16 words	4.5	2/6	4	IN-LINE	DIP16,.3	FIFOs	2.54 mm	125 Cel		16X4	16	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T16		6 V	5.08 mm	10 MHz	7.62 mm	Not Qualified	64 bit	2 V		e4			YES		19.305 mm	2250 ns
CD74HC40105M96E4	Texas Instruments	OTHER FIFO	MILITARY	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	500 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		16 words	4.5	2/6	4	SMALL OUTLINE	SOP16,.25	FIFOs	1.27 mm	125 Cel	3-STATE	16X4	16	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	1.75 mm	10 MHz	3.9 mm	Not Qualified	64 bit	2 V		e4	NOT SPECIFIED	260	YES		9.9 mm	2250 ns
CD74HC40105M96G4	Texas Instruments	OTHER FIFO	MILITARY	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	500 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	.16 mA	16 words	4.5	2/6	4	SMALL OUTLINE	SOP16,.25	FIFOs	1.27 mm	125 Cel		16X4	16	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	1.75 mm	12 MHz	3.9 mm	Not Qualified	64 bit	2 V		e4	30	260	YES		9.9 mm	2250 ns
CD74HC40105ME4	Texas Instruments	OTHER FIFO	MILITARY	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	500 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		16 words	4.5	2/6	4	SMALL OUTLINE	SOP16,.25	FIFOs	1.27 mm	125 Cel	3-STATE	16X4	16	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G16	1	6 V	1.75 mm	10 MHz	3.9 mm	Not Qualified	64 bit	2 V		e4	NOT SPECIFIED	260	YES		9.9 mm	2250 ns
NTE74HC40105	Nte Electronics	OTHER FIFO	INDUSTRIAL	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		1	CMOS	THROUGH-HOLE	PARALLEL	SYNCHRONOUS	50 mA	16 words	4.5		4	IN-LINE	DIP16,.3		2.54 mm	85 Cel	3-STATE	16X4	16	-40 Cel		DUAL	R-PDIP-T16		6 V	5.08 mm		7.62 mm		64 bit	2 V			NOT SPECIFIED	NOT SPECIFIED	YES		22 mm
7202LA25JGI8	Renesas Electronics		INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	1024 words	5		9	CHIP CARRIER			1.27 mm	85 Cel		1KX9	1K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm		11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e3	30	260	NO		13.97 mm	25 ns
72V02L15JG	Renesas Electronics	OTHER FIFO	COMMERCIAL	32	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	60 mA	1024 words	3.3		9	CHIP CARRIER	LCC32,.45X.55		1.27 mm	70 Cel	3-STATE	1KX9	1K	0 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-N32	3	3.6 V	2.79 mm		11.43 mm		9216 bit	3 V		e3	30	260	NO	.005 Amp	13.97 mm	15 ns
72V211L10PFG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	20 mA	512 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	FIFOs	.8 mm	70 Cel		512X9	512	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm	100 MHz	7 mm	Not Qualified	4608 bit	3 V		e3	30	260	YES	.005 Amp	7 mm	6.5 ns
72V241L10PFG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	20 mA	4096 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	FIFOs	.8 mm	70 Cel		4KX9	4K	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm	100 MHz	7 mm	Not Qualified	36864 bit	3 V		e3	30	260	YES	.005 Amp	7 mm	6.5 ns
72V241L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		4096 words	3.3		9	FLATPACK, LOW PROFILE			.8 mm	85 Cel		4KX9	4K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm		7 mm		36864 bit	3 V		e3	NOT SPECIFIED	260	YES		7 mm	10 ns
IDT72V241L10PFG8	Renesas Electronics		COMMERCIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		4096 words	3.3		9	FLATPACK, LOW PROFILE			.8 mm	70 Cel		4KX9	4K	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm		7 mm	Not Qualified	36864 bit	3 V		e3	30	260	YES		7 mm	6.5 ns
IDT72V7280L15BB	Integrated Device Technology	OTHER FIFO	COMMERCIAL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS	75 mA	16384 words	3.3	3.3	72	GRID ARRAY	BGA256,16X16,40	FIFOs	1 mm	70 Cel		16KX72	16K	0 Cel	Tin/Lead (Sn63Pb37)	BOTTOM	S-PBGA-B256	3	3.45 V	3.5 mm	66.7 MHz	17 mm	Not Qualified	1179648 bit	3.15 V	RETRANSMIT	e0	30	225	YES	.015 Amp	17 mm	10 ns
SN74V215-20PAG	Texas Instruments	OTHER FIFO	COMMERCIAL	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	20 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	35 mA	512 words	3.3	3.3	18	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	FIFOs	.5 mm	70 Cel	3-STATE	512X18	512	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	3.6 V	1.2 mm	133 MHz	10 mm	Not Qualified	9216 bit	3 V		e4	30	260	YES		10 mm	12 ns
5962-8952305EA	Defense Logistics Agency		MILITARY	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	100 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS		64 words	5		4	IN-LINE			2.54 mm	125 Cel		64X4	64	-55 Cel	TIN LEAD	DUAL	R-GDIP-T16		5.5 V	5.08 mm		7.62 mm	Not Qualified	256 bit	4.5 V		e0			NO		19.43 mm	55 ns
7203L12JG8	Renesas Electronics	BI-DIRECTIONAL FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	20 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	MATTE TIN	QUAD	R-PQCC-J32	3	5.5 V	3.556 mm	50 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V		e3	30	260	NO	.012 Amp	13.9954 mm	12 ns
7203L15JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.012 Amp	13.9954 mm	15 ns
72V2111L10PF8	Integrated Device Technology	OTHER FIFO	COMMERCIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	524288 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP64,.66SQ,32	FIFOs	.8 mm	70 Cel		512KX9	512K	0 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.45 V	1.6 mm	100 MHz	14 mm	Not Qualified	4718592 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN	e0	30	240	YES	.02 Amp	14 mm	6.5 ns
72V221L15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	20 mA	1024 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	FIFOs	.8 mm	85 Cel		1KX9	1K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm	66.7 MHz	7 mm	Not Qualified	9216 bit	3 V		e3	30	260	YES	.005 Amp	7 mm	10 ns
72V255LA10PFG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	8192 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.66SQ,32	FIFOs	.8 mm	70 Cel		8KX18	8K	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	100 MHz	14 mm	Not Qualified	147456 bit	3 V	RETRANSMIT	e3	30	260	YES	.02 Amp	14 mm	6.5 ns
72V255LA10TFG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	8192 words	3.3	3.3	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	FIFOs	.5 mm	70 Cel		8KX18	8K	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	100 MHz	10 mm	Not Qualified	147456 bit	3 V	RETRANSMIT	e3	30	260	YES	.02 Amp	10 mm	6.5 ns
72V255LA15PFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		8192 words	3.3		18	FLATPACK, LOW PROFILE			.8 mm	85 Cel		8KX18	8K	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm		14 mm	Not Qualified	147456 bit	3 V		e3	NOT SPECIFIED	260	YES		14 mm	10 ns
72V255LA15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	8192 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.6SQ,32	FIFOs	.8 mm	85 Cel		8KX18	8K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	147456 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
72V261LA10PFG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		16384 words	3.3		9	FLATPACK, LOW PROFILE			.8 mm	70 Cel		16KX9	16K	0 Cel		QUAD	S-PQFP-G64		3.6 V	1.6 mm		14 mm		147456 bit	3 V	RETRANSMIT				YES		14 mm	6.5 ns
72V261LA10TFG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	9	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	FIFOs	.5 mm	70 Cel		16KX9	16K	0 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	100 MHz	10 mm	Not Qualified	147456 bit	3 V	RETRANSMIT	e3	NOT SPECIFIED	260	YES	.02 Amp	10 mm	6.5 ns
72V263L7-5BCGI8	Renesas Electronics		INDUSTRIAL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	7.5 ns	1	CMOS	BALL	PARALLEL	SYNCHRONOUS		8192 words	3.3		18	GRID ARRAY, LOW PROFILE			1 mm	85 Cel		8KX18	8K	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B100	3	3.45 V	1.5 mm		11 mm		147456 bit	3.15 V	IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e1		260	YES		11 mm	5 ns
72V265LA10PFG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	FIFOs	.8 mm	70 Cel		16KX18	16K	0 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	100 MHz	14 mm	Not Qualified	294912 bit	3 V	RETRANSMIT	e3	NOT SPECIFIED	260	YES	.02 Amp	14 mm	6.5 ns
72V265LA15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.6SQ,32	FIFOs	.8 mm	85 Cel		16KX18	16K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	294912 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
72V265LA15TFGI8	Renesas Electronics	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	FIFOs	.5 mm	85 Cel		16KX18	16K	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	10 mm	Not Qualified	294912 bit	3 V		e3	30	260	YES	.02 Amp	10 mm	10 ns
72V271LA10PFG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	32768 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP64,.63SQ,32	FIFOs	.8 mm	70 Cel		32KX9	32K	0 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	100 MHz	14 mm	Not Qualified	294912 bit	3 V	RETRANSMIT; AUTO POWER DOWN	e3	NOT SPECIFIED	260	YES	.02 Amp	14 mm	6.5 ns
72V3642L10PFG8	Renesas Electronics	BI-DIRECTIONAL FIFO	COMMERCIAL	120	LFQFP	SQUARE	PLASTIC/EPOXY	YES	10 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		1024 words	3.3	3.3	36	FLATPACK, LOW PROFILE, FINE PITCH	QFP120,.63SQ,16	FIFOs	.4 mm	70 Cel		1KX36	1K	0 Cel	MATTE TIN	QUAD	S-PQFP-G120	3	3.45 V	1.6 mm	100 MHz	14 mm	Not Qualified	36864 bit	3.15 V	MAIL BOX BYPASS REGISTER	e3		260	YES	.005 Amp	14 mm	6.5 ns
74HC7403D,512	NXP Semiconductors	OTHER FIFO	AUTOMOTIVE	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	83.33 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	1 mA	64 words	5	2/6	4	SMALL OUTLINE	SOP16,.4	FIFOs	1.27 mm	125 Cel	3-STATE	64X4	64	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	1	6 V	2.65 mm	12 MHz	7.5 mm	Not Qualified	256 bit	2 V	REGISTER BASED; BUBBLE BACK 2.7US	e4			YES		10.3 mm	98 ns
IDT7203L12JG8	Renesas Electronics	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	20 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	2KX9	2K	0 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm	50 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e3	30	260	NO	.012 Amp	13.97 mm	12 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.