Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
SQUARE |
PLASTIC/EPOXY |
YES |
3 |
CMOS |
1 |
TR, 7 INCH |
1.8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
10.8 ns |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
S-PDSO-G8 |
1 |
5.5 V |
1.1 mm |
3 mm |
1.65 V |
e4 |
30 |
260 |
3 mm |
LVC/LCX/Z |
||||||||||||||||||
|
Nexperia |
BUFFER |
TIN |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Nexperia |
INVERTER |
TIN |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||
Nexperia |
MAJORITY LOGIC GATE |
INDUSTRIAL |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
1.2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
152 ns |
85 Cel |
-40 Cel |
BOTTOM |
R-PBCC-B6 |
2.75 V |
.35 mm |
.8 mm |
.7 V |
1 mm |
AXP |
||||||||||||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
1 |
TR, 13 INCH |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
29.3 ns |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
1.8 V |
e4 |
30 |
260 |
5 mm |
AHC/VHC/H/U/V |
||||||||||||||||||
|
Nexperia |
NAND GATE |
INDUSTRIAL |
NO LEAD |
6 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
1.2 |
SMALL OUTLINE |
116 ns |
.3 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
2.75 V |
.35 mm |
.9 mm |
.7 V |
e4 |
30 |
260 |
1 mm |
AXP |
|||||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
GULL WING |
5 |
TSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR, 7 INCH |
5 |
SMALL OUTLINE, THIN PROFILE |
10 ns |
.95 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.5 mm |
4.5 V |
e3 |
30 |
260 |
2.9 mm |
AHCT/VHCT/VT |
||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1 |
TR, 7 INCH |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
11 ns |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
4.5 V |
e3 |
30 |
260 |
2.05 mm |
AHCT/VHCT/VT |
|||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
1 |
TR, 13 INCH |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
19.6 ns |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
1.8 V |
e4 |
30 |
260 |
5 mm |
AHC/VHC/H/U/V |
|||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
AEC-Q100 |
1 |
TR, 13 INCH |
1.8 |
SMALL OUTLINE |
6.5 ns |
1.27 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.75 mm |
3.9 mm |
1.2 V |
e4 |
30 |
260 |
8.65 mm |
LVC/LCX/Z |
||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR, 7 INCH |
5 |
SMALL OUTLINE, VERY THIN PROFILE |
14.5 ns |
.5 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-N6 |
1 |
5.5 V |
.5 mm |
1 mm |
2 V |
e3 |
30 |
260 |
1.45 mm |
AHCT/VHCT/VT |
||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
6 |
TSSOP |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR, 7 INCH |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
125 ns |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
1 |
6 V |
1.1 mm |
1.25 mm |
2 V |
e3 |
30 |
260 |
2 mm |
HC/UH |
||||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
1 |
TR, 13 INCH |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
11.4 ns |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
4.5 V |
e4 |
30 |
260 |
5 mm |
AHCT/VHCT/VT |
|||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.1 |
SMALL OUTLINE, VERY THIN PROFILE |
20.8 ns |
.35 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
S-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
.8 V |
e3 |
30 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
AEC-Q100 |
1 |
1.8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
10.8 ns |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
1.65 V |
e3 |
30 |
260 |
2 mm |
LVC/LCX/Z |
||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR, 7 INCH |
1.8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8.4 ns |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-B6 |
1 |
5.5 V |
.35 mm |
.8 mm |
1.65 V |
e4 |
30 |
260 |
1 mm |
LVC/LCX/Z |
||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR, 7 INCH |
1.1 |
SMALL OUTLINE, VERY THIN PROFILE |
20.8 ns |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
.8 V |
e4 |
30 |
260 |
1.45 mm |
AUP/ULP/V |
||||||||||||||||||
|
Nexperia |
NOR GATE |
AUTOMOTIVE |
BUTT |
8 |
BCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
CHIP CARRIER |
14.3 ns |
.35 mm |
125 Cel |
3-STATE |
-40 Cel |
TIN |
BOTTOM |
R-PBCC-B8 |
1 |
3.6 V |
.35 mm |
1 mm |
.8 V |
e3 |
30 |
260 |
1.35 mm |
AVC |
||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3 |
CMOS |
1 |
TR, 7 INCH |
1.1 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
20.1 ns |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
3.6 V |
1 mm |
2 mm |
.8 V |
SEATED HGT-NOM |
e4 |
30 |
260 |
2.3 mm |
AUP/ULP/V |
|||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3 |
CMOS |
1 |
TR, 7 INCH |
1.1 |
SMALL OUTLINE |
20 ns |
.3 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
1 |
3.6 V |
.35 mm |
1 mm |
.8 V |
e3 |
30 |
260 |
1.2 mm |
AUP/ULP/V |
||||||||||||||||||
|
Nexperia |
NAND GATE |
AUTOMOTIVE |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
3 |
TR, 7 INCH |
1.8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
21.5 ns |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
1.65 V |
e3 |
30 |
260 |
2 mm |
LVC/LCX/Z |
|||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR, 7 INCH |
1.8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8.2 ns |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-B6 |
1 |
5.5 V |
.35 mm |
.8 mm |
1.65 V |
e4 |
30 |
260 |
1 mm |
LVC/LCX/Z |
||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
TR, 7 INCH |
1.1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
20.8 ns |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-B6 |
1 |
3.6 V |
.35 mm |
.8 mm |
.8 V |
e4 |
30 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||||||||||
|
Nexperia |
BUFFER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
1 |
TR, 13 INCH |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
12.1 ns |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
4.5 V |
e4 |
30 |
260 |
5 mm |
AHCT/VHCT/VT |
||||||||||||||||||
Nexperia |
AND GATE |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
1.8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
21.5 ns |
125 Cel |
-40 Cel |
BOTTOM |
R-PBCC-B6 |
5.5 V |
.35 mm |
.8 mm |
1.65 V |
1 mm |
LVC/LCX/Z |
||||||||||||||||||||||||||
|
Nexperia |
MAJORITY LOGIC GATE |
INDUSTRIAL |
BUTT |
8 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
1.2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
225 ns |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-B8 |
1 |
2.75 V |
.35 mm |
.8 mm |
.7 V |
e4 |
30 |
260 |
1.35 mm |
AXP |
|||||||||||||||||||
|
Nexperia |
OR GATE |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
TR, 7 INCH |
1.8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
21.5 ns |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-B6 |
1 |
5.5 V |
.35 mm |
.8 mm |
1.65 V |
e4 |
30 |
260 |
1 mm |
LVC/LCX/Z |
|||||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.1 |
SMALL OUTLINE, VERY THIN PROFILE |
16.3 ns |
.35 mm |
125 Cel |
-40 Cel |
DUAL |
S-PDSO-N6 |
3.6 V |
.5 mm |
1 mm |
.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
1 mm |
AUP/ULP/V |
||||||||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR, 7 INCH |
1.1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
20.9 ns |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-B6 |
1 |
3.6 V |
.35 mm |
.8 mm |
.8 V |
e4 |
30 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||||||||||
|
Nexperia |
AND GATE |
TIN |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||
Nexperia |
BUFFER |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
1.8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
8.4 ns |
125 Cel |
OPEN-DRAIN |
-40 Cel |
BOTTOM |
R-PBCC-B6 |
5.5 V |
.35 mm |
.8 mm |
1.65 V |
1 mm |
LVC/LCX/Z |
|||||||||||||||||||||||||
|
Nexperia |
INVERTER |
TIN |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Nexperia |
AND GATE |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
130 ns |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
2.75 V |
.5 mm |
1 mm |
.7 V |
e4 |
30 |
260 |
1.45 mm |
AXP |
|||||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR, 7 INCH |
1.1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
20.8 ns |
.65 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G5 |
1 |
3.6 V |
1.1 mm |
1.25 mm |
.8 V |
e3 |
30 |
260 |
2.05 mm |
AUP/ULP/V |
||||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR, 7 INCH |
1.1 |
SMALL OUTLINE, VERY THIN PROFILE |
20.8 ns |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.5 mm |
1 mm |
.8 V |
e4 |
30 |
260 |
1.45 mm |
AUP/ULP/V |
||||||||||||||||||
|
Nexperia |
INVERTER |
INDUSTRIAL |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
1.2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
126 ns |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-B6 |
1 |
2.75 V |
.35 mm |
.8 mm |
.7 V |
e4 |
30 |
260 |
1 mm |
AXP |
||||||||||||||||||||
|
Nexperia |
INVERTER |
TIN |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Nexperia |
NOR GATE |
TIN |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||
|
Nexperia |
AND GATE |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
88 ns |
.35 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
1 |
2.75 V |
.35 mm |
1 mm |
.7 V |
e4 |
30 |
260 |
1 mm |
AXP |
||||||||||||||||||
|
Nexperia |
INVERTER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
1 |
TR, 13 INCH |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
14.5 ns |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.1 mm |
4.4 mm |
4.5 V |
e4 |
30 |
260 |
5 mm |
AHCT/VHCT/VT |
||||||||||||||||||
|
Nexperia |
XOR GATE |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
164 ns |
.35 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
1 |
2.75 V |
.35 mm |
1 mm |
.7 V |
e4 |
30 |
260 |
1 mm |
AXP |
|||||||||||||||||||
|
Nexperia |
MAJORITY LOGIC GATE |
INDUSTRIAL |
NO LEAD |
6 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
1.2 |
SMALL OUTLINE |
166 ns |
.3 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
2.75 V |
.35 mm |
.9 mm |
.7 V |
e4 |
30 |
260 |
1 mm |
AXP |
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|
Nexperia |
NAND GATE |
INDUSTRIAL |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
116 ns |
.55 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
1 |
2.75 V |
.35 mm |
1 mm |
.7 V |
e4 |
30 |
260 |
1 mm |
AXP |
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|
Nexperia |
MAJORITY LOGIC GATE |
INDUSTRIAL |
GULL WING |
8 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
225 ns |
.5 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
2.75 V |
1 mm |
2 mm |
.7 V |
SEATED HGT-NOM |
e4 |
30 |
260 |
2.3 mm |
AXP |
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|
Nexperia |
INVERTER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
TR, 7 INCH |
5 |
SMALL OUTLINE, VERY THIN PROFILE |
14.5 ns |
.5 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-N6 |
1 |
5.5 V |
.5 mm |
1 mm |
2 V |
e3 |
30 |
260 |
1.45 mm |
AHC/VHC/H/U/V |
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Nexperia |
INVERTER |
AUTOMOTIVE |
BUTT |
6 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
1.1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
20.9 ns |
125 Cel |
-40 Cel |
BOTTOM |
R-PBCC-B6 |
3.6 V |
.35 mm |
.8 mm |
.8 V |
1 mm |
AUP/ULP/V |
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|
Nexperia |
NAND GATE |
AUTOMOTIVE |
BUTT |
8 |
HVBCC |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
TR, 7 INCH |
2.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
10.8 ns |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-B8 |
1 |
5.5 V |
.35 mm |
.8 mm |
1.65 V |
e4 |
30 |
260 |
1.35 mm |
LVC/LCX/Z |
||||||||||||||||||
|
Nexperia |
AND GATE |
INDUSTRIAL |
NO LEAD |
10 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
2 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
222 ns |
.35 mm |
85 Cel |
3-STATE |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N10 |
1 |
2.75 V |
.5 mm |
1 mm |
.7 V |
e4 |
30 |
260 |
1.7 mm |
AXP |
Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.
Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.
Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.
Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.
Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.
Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.