Maxim Integrated Analog-to-Digital Converters 2,400+

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Part	Manufacturer	Converter Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Analog In Channels	Surface Mount	Maximum Analog Input Voltage	Sample Rate	No. of Functions	Technology	Screening Level	No. of Bits	Maximum Supply Current	Maximum Linearity Error (EL)	Nominal Supply Voltage	Output Bit Code	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Analog Input Voltage	Output Format	Minimum Operating Temperature	Terminal Finish	Sample and Hold/Track and Hold	Terminal Position	Maximum Conversion Time	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MX7820KEWP-T	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5.1 V		1	CMOS		8			5 V	BINARY			SMALL OUTLINE			1.27 mm	70 Cel	-.1 V	PARALLEL, 8 BITS	0 Cel		TRACK	DUAL	2 us	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12.8 mm
MX7572SQ12/883B	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	5 V		1	CMOS	MIL-STD-883	12		.024 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY		-15 V	IN-LINE			2.54 mm	125 Cel	0 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD		DUAL	13 us	R-GDIP-T24	1	5.08 mm	7.62 mm	Not Qualified	e0
MX7576SQ	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC	1	NO	2.46 V		1	CMOS		8		.3906 %	5 V	OFFSET BINARY			IN-LINE				125 Cel	0 V	SERIAL	-55 Cel	Tin/Lead (Sn/Pb)	TRACK	DUAL	30 us	R-CDIP-T18	1			Not Qualified	e0
MX7575J/D-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	1	YES	2.46 V		1	CMOS		8		.3906 %	5 V	OFFSET BINARY			UNCASED CHIP				70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	UPPER	15 us	R-XUUC-N20				Not Qualified	e0
MX7576KCWN+	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.3906 %	5 V	BINARY	5		SMALL OUTLINE	SOP18,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN	TRACK	DUAL	30 us	R-PDSO-G18	1	2.65 mm	7.5 mm	Not Qualified	e3	30	260	11.55 mm
MX7572JN12-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	5 V		1	CMOS		12	12 mA	.024 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY		-15 V	IN-LINE			2.54 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		DUAL	13000000 us	R-PDIP-T24		4.572 mm	7.62 mm	Not Qualified	e0			30.545 mm
MX7828KCWI-T	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	8	YES	5.25 V		1	CMOS		8			5 V	COMPLEMENTARY OFFSET BINARY	5		SMALL OUTLINE	SOP28,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	DUAL	2.4 us	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
MX674AKEJI	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE		DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	10 V		1	BICMOS		12		.0122 %	15 V	OFFSET BINARY		-15 V	IN-LINE				70 Cel	-10 V	PARALLEL, WORD	0 Cel		SAMPLE	DUAL	15 us	R-PDIP-T						NOT SPECIFIED	NOT SPECIFIED
MX7581CD	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	8	NO	5 V		1	CMOS		8		.1953 %	5 V	BINARY, OFFSET BINARY, COMPLEMENTARY BINARY	5		IN-LINE	DIP28,.6	Analog to Digital Converters	2.54 mm	85 Cel	-5 V	PARALLEL, 8 BITS	-40 Cel	GOLD OVER NICKEL		DUAL		R-GDIP-T28	1	5.89 mm	15.24 mm	Not Qualified	e4		245
MX7820TQ	Maxim Integrated	ADC, FLASH METHOD	MILITARY	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	5.1 V		1	CMOS		8			5 V	BINARY	5		IN-LINE	DIP20,.3	Analog to Digital Converters	2.54 mm	125 Cel	-.1 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD	TRACK	DUAL	2.5 us	R-GDIP-T20	1	5.08 mm	7.62 mm	Not Qualified	e0			24.13 mm
MX7828LCWI+	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	8	YES	5.25 V		1	CMOS		8			5 V	COMPLEMENTARY OFFSET BINARY	5		SMALL OUTLINE	SOP28,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN	TRACK	DUAL	2.4 us	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e3	30	260	17.9 mm
MX7820KCWP-T	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5.1 V		1	CMOS		8			5 V	BINARY	5		SMALL OUTLINE	SOP20,.4	Analog to Digital Converters	1.27 mm	70 Cel	-.1 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	DUAL	2 us	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	e0			12.8 mm
MX674ALCWI-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	10 V		1	BICMOS		12	10 mA	.012 %	15 V	BINARY, OFFSET BINARY		-15 V	SMALL OUTLINE			1.27 mm	70 Cel	-10 V	PARALLEL, WORD	0 Cel	TIN LEAD		DUAL	15 us	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
AD7575KEWN	Maxim Integrated	A/D CONVERTER	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.2 %	5 V	OFFSET BINARY	5		SMALL OUTLINE	SOP18,.4	Analog to Digital Converters	1.27 mm	85 Cel			-40 Cel	Tin/Lead (Sn/Pb)		DUAL		R-PDSO-G18				Not Qualified	e0
MX7828LEAI	Maxim Integrated	ADC, FLASH METHOD	INDUSTRIAL	GULL WING	28	SSOP		PLASTIC/EPOXY	8	YES	5.25 V		1	CMOS		8			5 V	COMPLEMENTARY OFFSET BINARY			SMALL OUTLINE, SHRINK PITCH				85 Cel	0 V	PARALLEL, 8 BITS	-40 Cel	Tin/Lead (Sn/Pb)	TRACK	DUAL	2.4 us		1			Not Qualified	e0
MX7576KP-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.3906 %	5 V	BINARY	5		CHIP CARRIER	LDCC20,.4SQ	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	QUAD	30 us	S-PQCC-J20	1	4.57 mm	8.965 mm	Not Qualified	e0			8.965 mm
MX7821KEWP	Maxim Integrated	ADC, FLASH METHOD	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	2.5 V		1	CMOS		8			5 V	BINARY	5,GND/-5	-5 V	SMALL OUTLINE	SOP20,.4	Analog to Digital Converters	1.27 mm	85 Cel	-2.5 V	PARALLEL, 8 BITS	-40 Cel	TIN LEAD	TRACK	DUAL	.875 us	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e0	20	240	12.8 mm
MX7672BQ10	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	2	NO	5 V		1	BICMOS		12		.0244 %	5 V	BINARY	5,-12	-12 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	85 Cel	-5 V	PARALLEL, WORD	-40 Cel	Tin/Lead (Sn85Pb15)		DUAL	10.4 us	R-GDIP-T24	1	5.72 mm	15.24 mm	Not Qualified	e0		245
MX7821TQ/883B	Maxim Integrated	ADC, FLASH METHOD	MILITARY	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	2.5 V		1			8			5 V	BINARY		-5 V	IN-LINE			2.54 mm	125 Cel	-2.5 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD	TRACK	DUAL	.4 us	R-GDIP-T20	1	5.08 mm	7.62 mm	Not Qualified	e0			26.16 mm
MX7574J/D	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	1	YES	10 V		1	CMOS		8			5 V	BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY			UNCASED CHIP				70 Cel	-10 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		UPPER		R-XUUC-N18				Not Qualified	e0
MX7672KP05+	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	2	YES	5 V		1	BICMOS		12		.0244 %	5 V	BINARY	5,-12	-12 V	CHIP CARRIER	LDCC28,.5SQ	Analog to Digital Converters	1.27 mm	70 Cel	-5 V	PARALLEL, WORD	0 Cel	MATTE TIN		QUAD	5.2 us	S-PQCC-J28	1	4.57 mm	11.505 mm	Not Qualified	e3		245	11.505 mm
MXB7843EEE	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	2	YES	5.25 V	.125 MHz	1	BICMOS		12		.0488 %	2.7 V	BINARY			SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	0 V	SERIAL	-40 Cel	TIN LEAD	TRACK	DUAL	6 us	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX674ASQ	Maxim Integrated
MX7572UQ12	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	5 V		1	CMOS		12	12 mA	.012 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY	5,-15	-15 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	125 Cel	0 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD		DUAL	13000000 us	R-GDIP-T24	1	5.08 mm	7.62 mm	Not Qualified	e0
MXB7846EUE+T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	2	YES	2.5 V	.125 MHz	1	BICMOS		12		.0488 %	2.7 V	BINARY			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	0 V	SERIAL	-40 Cel	MATTE TIN	TRACK	DUAL	6 us	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MX7572KCWG12+	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5 V		1	CMOS		12	12 mA	.024 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY	5,-15	-15 V	SMALL OUTLINE	SOP24,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN		DUAL	13000000 us	R-PDSO-G24	1	2.65 mm	7.5 mm	Not Qualified	e3			15.4 mm
MX7821KEPP+	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	2.5 V		1			8			5 V	BINARY		-5 V	IN-LINE			2.54 mm	70 Cel	-2.5 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN	TRACK	DUAL	.4 us	R-PDIP-T20	1	4.572 mm	7.62 mm	Not Qualified	e3	30	260	26.16 mm
MX7672UQ10-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	2	NO	5 V		1	BICMOS		12		.0183 %	5 V	BINARY	5,-12	-12 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	125 Cel	-5 V	PARALLEL, WORD	-55 Cel	TIN LEAD		DUAL	10.4 us	R-GDIP-T24		5.72 mm	15.24 mm	Not Qualified	e0
MXB7846EEE	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	2	YES	2.5 V	.125 MHz	1	BICMOS		12		.0488 %	2.7 V	BINARY			SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	0 V	SERIAL	-40 Cel	TIN LEAD	TRACK	DUAL	6 us	R-PDSO-G16	1	1.73 mm	3.9 mm	Not Qualified	e0			4.89 mm
MX674ALCJI	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE		DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	10 V		1	BICMOS		12		.0122 %	15 V	OFFSET BINARY		-15 V	IN-LINE				70 Cel	-10 V	PARALLEL, WORD	0 Cel		SAMPLE	DUAL	15 us	R-PDIP-T						NOT SPECIFIED	NOT SPECIFIED
MX7576KN+	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	2.46 V		1	CMOS		8		.3906 %	5 V	BINARY	5		IN-LINE	DIP18,.3	Analog to Digital Converters	2.54 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN	TRACK	DUAL	30 us	R-PDIP-T18	1	4.572 mm	7.62 mm	Not Qualified	e3			22.86 mm
MX7828LCWI-T	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	8	YES	5.25 V		1	CMOS		8			5 V	COMPLEMENTARY OFFSET BINARY	5		SMALL OUTLINE	SOP28,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	DUAL	2.4 us	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
MX674ALD	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	1	NO	10 V		1	BICMOS		12		.0122 %	15 V	OFFSET BINARY	5,+-12/+-15	-15 V	IN-LINE	DIP28,.6	Analog to Digital Converters	2.54 mm	70 Cel	-10 V	PARALLEL, WORD	0 Cel	TIN LEAD	SAMPLE	DUAL	15 us	R-CDIP-T28		5.72 mm	15.24 mm		e0			37.85 mm
MX7574TD	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	18	DIP	RECTANGULAR	UNSPECIFIED	1	NO	10 V		1	CMOS		8		.2 %	5 V	BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY	5		IN-LINE	DIP18,.3	Analog to Digital Converters	2.54 mm	125 Cel	-10 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD		DUAL		R-XDIP-T18	1	5.72 mm	7.62 mm	Not Qualified	e0
MX7672TQ05	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	2	NO	5 V		1	BICMOS		12		.0244 %	5 V	BINARY	5,-12	-12 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	125 Cel	-5 V	PARALLEL, WORD	-55 Cel	TIN LEAD		DUAL	5.2 us	R-GDIP-T24	1	5.72 mm	15.24 mm	Not Qualified	e0
MX7582KP-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	4	YES	5 V		1	CMOS		12	7.5 mA		15 V	BINARY	+-5,15	-5 V	CHIP CARRIER	LDCC28,.5SQ	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		QUAD	150 us	S-PQCC-J28	1	4.57 mm	11.505 mm	Not Qualified	e0			11.505 mm
MX7578KN	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	5 V		1	CMOS		12			5 V	BINARY	+-5,15	-5 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		DUAL	150 us	R-PDIP-T24	1	5.08 mm	15.24 mm	Not Qualified	e0	20	245	31.75 mm
MX7672TQ10	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	2	NO	5 V		1	BICMOS		12		.0244 %	5 V	BINARY	5,-12	-12 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	125 Cel	-5 V	PARALLEL, WORD	-55 Cel	TIN LEAD		DUAL	10.4 us	R-GDIP-T24	1	5.72 mm	15.24 mm	Not Qualified	e0
MX7576JCWN+	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.3906 %	5 V	BINARY	5		SMALL OUTLINE	SOP18,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN	TRACK	DUAL	30 us	R-PDSO-G18	1	2.65 mm	7.5 mm	Not Qualified	e3	30	260	11.55 mm
MX7820KN	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	5.1 V		1	CMOS		8			5 V	BINARY	5		IN-LINE	DIP20,.3	Analog to Digital Converters	2.54 mm	70 Cel	-.1 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	DUAL	2 us	R-PDIP-T20	1	4.572 mm	7.62 mm	Not Qualified	e0		245	26.16 mm
MX674ALEWI	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	10 V		1	BICMOS		12	10 mA	.012 %	15 V	BINARY, OFFSET BINARY	5,+-12/+-15	-15 V	SMALL OUTLINE	SOP28,.4	Analog to Digital Converters	1.27 mm	85 Cel	-10 V	PARALLEL, WORD	-40 Cel	TIN LEAD		DUAL	15 us	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
MX7672LP05-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	2	YES	5 V		1	BICMOS		12		.0122 %	5 V	BINARY	5,-12	-12 V	CHIP CARRIER	LDCC28,.5SQ	Analog to Digital Converters	1.27 mm	70 Cel	-5 V	PARALLEL, WORD	0 Cel	TIN LEAD		QUAD	5.2 us	S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified	e0			11.505 mm
MX7572KCWG12	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5 V		1	CMOS		12	12 mA	.024 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY	5,-15	-15 V	SMALL OUTLINE	SOP24,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		DUAL	13000000 us	R-PDSO-G24	1	2.65 mm	7.5 mm	Not Qualified	e0			15.4 mm
MX7575JP-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.3906 %	5 V	OFFSET BINARY	5		CHIP CARRIER	LDCC20,.4SQ	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	QUAD	15 us	S-PQCC-J20	1	4.57 mm	8.965 mm	Not Qualified	e0			8.965 mm
MX7581JCWI-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	8	YES	5 V		1	CMOS		8		.7324 %	5 V	BINARY, OFFSET BINARY, COMPLEMENTARY BINARY	5		SMALL OUTLINE	SOP28,.5	Analog to Digital Converters	1.27 mm	70 Cel	-5 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		DUAL		R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
MX7820KEWP	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5.1 V		1	CMOS		8			5 V	BINARY			SMALL OUTLINE			1.27 mm	70 Cel	-.1 V	PARALLEL, 8 BITS	0 Cel		TRACK	DUAL	2 us	R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	12.8 mm
MX7572SQ05/883B	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	5 V		1	CMOS		12		.024 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY		-15 V	IN-LINE			2.54 mm	125 Cel	0 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD		DUAL	5.2 us	R-GDIP-T24	1	5.08 mm	7.62 mm	Not Qualified	e0
MAX574ALN	Maxim Integrated

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.